Teradyne
J 750
Plate 01Test Program Generation for J750 CC - PC Screen capture.
KF KwokWatch on YouTube
Power
3 Phase[3]
Control era
Windows XP SP3
What it is
General reference — not yet source-verifiedAutomatic test systems in this class apply electrical stimuli to semiconductor devices and measure the responses against programmed limits. Test-and-probe equipment of this class is used to verify device function, parametric behavior, and continuity before parts move onward in manufacturing or handling flow.
How it works
General reference — not yet source-verifiedAutomatic test equipment of this class connects a test head to a device interface and routes signals through channel resources while separate power resources bias the device under test. Automatic test equipment of this class executes test programs that drive vectors, force and measure electrical conditions, and compare measured behavior with pass or fail criteria.
Where it fits in the process flow
General reference — not yet source-verifiedTest-and-probe systems of this class sit in the electrical test portion of semiconductor manufacturing rather than in deposition, lithography, etch, or packaging assembly operations. Test-and-probe systems of this class are used after device fabrication has produced structures that can be contacted electrically, and they provide screening and characterization information for downstream handling decisions.
Applications
General reference — not yet source-verifiedAutomatic test equipment of this class is used for electrical validation of semiconductor devices at wafer probe or closely related test stages. Automatic test equipment of this class supports production screening, debug, characterization, and binning workflows where devices are contacted and evaluated through programmed measurements.
What do the numbers mean?
Vintage & configurations
Control-system eraWindows XP SP3[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Advantest HP / Verigy PS 1600 Smartscale— Same function class: Test & Probe, UnknownCompare in depthsource[16]
- Advantest HP / Verigy PS 3600 Pinscale— Same function class: Test & Probe, UnknownCompare in depthsource[17]
- Advantest 93000— Same function class: Test & Probe, UnknownCompare in depthsource[18]
- Advantest V 93000— Same function class: Test & Probe, UnknownCompare in depthsource[19]
- LTX-Credence TMT ASL 1000 165— Same function class: Test & Probe, UnknownCompare in depthsource[20]
- Eagle ETS 200 T— Same function class: Test & Probe, UnknownCompare in depthsource[21]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
- Teradyne J 750 ICUD BoardIn Productionsource[22]
- Teradyne J 750 HSD 800 BoardIn Productionsource[23]
- Teradyne J 750 DPS BoardIn Productionsource[24]
- Teradyne J 750 DPS BoardIn Productionsource[25]
- Teradyne J 750 BoardIn Productionsource[26]
- Teradyne J 750 DSMTO (HSD 200) 239-701-00 BoardIn Productionsource[27]
- Teradyne J 750 DSIO BoardIn Productionsource[28]
- Teradyne J 750 BoardIn Productionsource[29]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Teradyne J 750 used for?
The Teradyne J 750 is a semiconductor test system used for testing integrated circuits, including wafer-form testing at a probe station.[2][15]
How does the J 750 connect to a probe station?
The J 750 connects to a probe station through a test head and a pogo tower that contacts the tester and the probe card.[15]
What happens at the wafer during J 750 probe testing?
The probe station aligns the wafer, the probe card touches the pads on the integrated circuit, and the tester sends signals and analyzes the responses.[15]
Can the J 750 be used after wafer probe?
The J 750 can also be used during handler-based testing after the wafer is cut and the individual integrated circuits are packaged.[15]
Not publicly documented
The following facts about the J 750 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the J 750 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the J 750 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the J 750 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the J 750 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly hosted manuals, SOPs, or datasheets for the J 750 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (32)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Inventory photo
- [12]Inventory photo
- [13]inventory listing
- [14]inventory listing
- [15]patents.google.com — patents.google.compatents.google.com
- [16]Equipment inventory listing
- [17]Equipment inventory listing
- [18]Equipment inventory listing
- [19]Equipment inventory listing
- [20]Equipment inventory listing
- [21]Equipment inventory listing
- [22]Equipment inventory listing
- [23]Equipment inventory listing
- [24]Equipment inventory listing
- [25]Equipment inventory listing
- [26]Equipment inventory listing
- [27]Equipment inventory listing
- [28]Equipment inventory listing
- [29]Equipment inventory listing
- [30]Equipment inventory listing
- [31]Teradyne - Divisions Contact Information — teradyne.com (Feb 10, 2014)web.archive.org
- [32]US6466007B1 - Test system for smart card and indentification devices and the like - Google Patents — patents.google.compatents.google.com
Last updated Oct 20, 2026.
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