Electroglas
Provisional entry — research in progress
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Wafer probers bring a wafer into controlled contact with a probe card so test instrumentation can measure devices before singulation. A prober class machine handles wafer loading, wafer positioning, alignment, touchdown, and stepping from die to die under programmed control. Probe stations of this class are built around a chuck, motion stages, alignment optics, and interfaces to external electrical test systems.
Wafer probing sits after front-end wafer fabrication and before dicing, assembly, and final packaged test. Probe results are used to screen die, characterize electrical behavior, and support disposition of wafers before downstream packaging work begins. In production and engineering flows, probers also support feedback to process control by linking measured electrical behavior to fabrication conditions.
Wafer probers are used for wafer sort, parametric measurements, device characterization, and engineering debug on completed wafers. Such systems are applied where electrical contact must be made repeatedly across many die locations with controlled alignment and touchdown. Probe platforms of this class are also used with temperature-conditioned chucks when test conditions require thermal control during contact.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EG 2001 Prober - Hot chuck | — | — | Described as a hot chuck prober. | Equipment inventory listing[2] |
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The following facts about the EG 2001 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 2001 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EG 2001 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 2001 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG 2001 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly hosted manuals, SOPs, or datasheets for the EG 2001 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
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Last updated Oct 18, 2026.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.