Waferpedia

GCA

8500 Wafer

LithographyGCA 8500 Wafer family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The GCA 8500 is a wafer stepper used for photolithography, performing 5x reduction. The GCA 8500 uses an i-line exposure source and resolves sub-micron features. The GCA 8500 accepts 150 mm wafers.[1][2]

8500 Wafer — Inventory photo
Fig. 018500 WaferInventory photo[1]

What it is

The GCA 8500 is a wafer stepper used for photolithography. The GCA 8500 uses 5x reduction i-line optics. The system incorporates a 5-axis alignment stage.[1][3][2]

How it works

The GCA 8500 utilizes a 5x reduction lens. The stepper includes a 5-axis alignment system.[1]

Where it fits in the process flow

General reference — not yet source-verified

Wafer steppers are used in the photolithography stage of semiconductor fabrication. The process step follows wafer cleaning and photoresist coating. After exposure, the wafer proceeds to post-exposure bake and development.

What do the numbers mean?

Wafer handling7

Equipment type
Commercial wafer stepper[3]
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Wafer diameter
150 mm[3]
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Wafer geometry supported
1-flat, 2-flat, notched, no-flat[3]
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Wafer materials supported
Silicon, silicon on insulator[3]
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Wafer thickness range
500–700 µm[3]
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Batch size
1 wafer (150 mm)[3]
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Demonstrated wafer use
6-inch silicon-on-insulator wafer[2]
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Optics & imaging2

Exposure source
i-line[3]
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Resolution capability
Sub-micron features[2]
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Configuration & options5

5 Axis[1]
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5x Reduction[1]
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OEM
GCA[1]
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Reduction ratio
5x[1]
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Axis configuration
5-axis[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer materials can the GCA 8500 process?

The GCA 8500 can process silicon and silicon-on-insulator wafers.[3]

Not publicly documented

The following facts about the 8500 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8500 Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 8500 Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 8500 Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 8500 Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 8500 Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]journals.plos.orgjournals.plos.orgjournals.plos.org
  3. [3]mems-exchange.orgmems-exchange.orgmems-exchange.org
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Last updated Sep 1, 2026.

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