Waferpedia

Heidelberg Instruments

DWL66

DWL66 — web.archive.org
Fig. 01DWL66web.archive.org[1]
  • Plate 01Replacing Photomasks with Direct Write Lithography | DWL 66⁺ User Interview at Koç University

    Heidelberg InstrumentsWatch on YouTube
  • Plate 02How the Sydney Nano Foundry Uses the DWL 66⁺ Laser Lithography System

    Heidelberg InstrumentsWatch on YouTube
  • Plate 03Heidelberg DWL66+ Tool Training Part 3, Running the Exposure

    Quattrone Nanofabrication FacilityWatch on YouTube
  • Plate 04Heidelberg DWL66+ Tool Training Part 1, Introduction

    Quattrone Nanofabrication FacilityWatch on YouTube
  • Plate 05Laser Writer DWL66+ LIT 027 Basic Exposure Training

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  • Plate 06DWL 66 Exposure

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Wafer size

6"

Gas delivery

photoresist[1]

Optics

40 nm, 100 nm, 200 nm, 400 nm[1]

What is it?

The Heidelberg Instruments DWL66 is described as an economical, high-resolution direct write pattern generator for direct writing on various substrates and mask making. It is stated to be suitable for rapid prototyping of 2D and 3D microstructures on substrates up to 6 inches square, with optional alignment and grayscale exposure capabilities.

What can it run?

Process applications and technology nodes documented for this tool.

  • Reticles
  • ASICs
  • MEMS
  • TFTs
  • Sensors
  • MCMs
  • Integrated Optics
  • MOEMS
  • refractive optics
  • diffractive optics
  • Micro Fluidics

What do the numbers mean?

Wafer handling2

Substrates
glass, silicon or any other flat materials[1]
Accurate?
Substrate size
up to 200 mm by 200 mm[2]
Accurate?

Gas & chemistry1

Exposure
photoresist[1]
Accurate?

Optics & imaging2

Resolution
40 nm, 100 nm, 200 nm, 400 nm[1]
Accurate?
Laser sources
244 nm, 363 nm, 413 nm, 442 nm[1]
Accurate?

Configuration & options3

Minimum feature
0.5 µm[1]
Accurate?
Image size
140 mm x 140 mm[1]
Accurate?
Minimum feature
down to 0.6 microns[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
DWL 66 fsDescribed as a high accuracy maskless lithography system; accommodates substrate size up to 200 mm by 200 mm and can expose features down to 0.6 microns.web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Exposurephotoresist[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the DWL66 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DWL66 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DWL66 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DWL66 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DWL66 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DWL66 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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