2043MK5-VR

Vacuum reflow ovens heat assembled substrates along a conveyorized thermal path and apply vacuum during the solder reflow process to reduce entrapped gas in solder joints. Vacuum reflow ovens are used where thermal uniformity, controlled atmosphere processing, and reduced solder voiding are important to assembly quality.

The Heller 2043MK5-VR uses convection zones arranged as 10 top and 10 bottom zones, plus 3 top IR zones. The Heller 2043MK5-VR provides 327 cm of convection heated length and 430 cm of total heated length. The Heller 2043MK5-VR has 3 top cool zones, with a bottom option available. The Heller 2043MK5-VR provides cooling rates greater than 3°C per second. The Heller 2043MK5-VR supports process gas options of air, nitrogen, formic acid, and forming gas. The Heller 2043MK5-VR has a standard minimum vacuum of 10 Torr and an optional capability below 10 Torr. The Heller 2043MK5-VR has standard maximum working temperatures of 350°C for convection and 400°C for IR, with optional maximum working temperatures of 400°C for convection and 480°C for IR.^[1][2]

Reflow ovens sit after solder paste deposition and component placement in an electronics assembly flow. Reflow ovens form permanent solder joints by heating the assembled substrate through a controlled thermal profile. Inspection and verification commonly follow reflow to check joint formation, alignment, and voiding performance.

The Heller 2043MK5-VR supports air, nitrogen, formic acid, and forming gas process options. The Heller 2043MK5-VR includes a vacuum chamber sized for boards up to 500 mm in length. The Heller 2043MK5-VR has a maximum board size of 500 mm by 450 mm by 29 mm. The Heller 2043MK5-VR has a cleanroom option down to Class 1000.^[1][2]