KLA
The KLA FLX 2320 Thin Film Stress Measurement is a thin film stress measurement system. The KLA FLX 2320 Thin Film Stress Measurement is used in semiconductor manufacturing for metrology and inspection. The KLA FLX 2320 Thin Film Stress Measurement supports 8 inch wafers.[1][2]

Thin film stress measurement systems are metrology tools used to quantify mechanical stress associated with deposited films on substrates. Thin film stress measurement systems are generally used to monitor film behavior that can affect pattern fidelity, adhesion, cracking, bow, and downstream integration.
Thin film stress tools commonly infer film stress from substrate curvature rather than by contacting the film mechanically. Thin film stress tools generally compare a substrate condition before and after a process step and convert the curvature change into a stress value through a film and substrate model.
Thin film stress metrology is typically placed around deposition and thermal processing steps. Thin film stress metrology is commonly used after film formation and after thermal exposure to verify that the film stack remains within process limits before later patterning, etch, integration, or reliability work.
Thin film stress metrology is used wherever film mechanics influence yield, device behavior, or package interaction. Thin film stress metrology is relevant to metal films, dielectric films, barrier layers, and other deposited stacks whose thermal mismatch or intrinsic stress can affect subsequent processing.
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The following facts about the FLX 2320 Thin Film Stress Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FLX 2320 Thin Film Stress Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FLX 2320 Thin Film Stress Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FLX 2320 Thin Film Stress Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FLX 2320 Thin Film Stress Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FLX 2320 Thin Film Stress Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 19, 2026.
The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.