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KLA

FLX 2320 Thin Film Stress Measurement

Metrology & InspectionKLA FLX 2320 family
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The KLA FLX 2320 Thin Film Stress Measurement is a thin film stress measurement system. The KLA FLX 2320 Thin Film Stress Measurement is used in semiconductor manufacturing for metrology and inspection. The KLA FLX 2320 Thin Film Stress Measurement supports 8 inch wafers.[1][2]

FLX 2320 Thin Film Stress Measurement — Inventory photo
Fig. 01FLX 2320 Thin Film Stress MeasurementInventory photo[3]

Power

60 Hz[3]

Optics

Dual Wavelength[3]

What it is

General reference — not yet source-verified

Thin film stress measurement systems are metrology tools used to quantify mechanical stress associated with deposited films on substrates. Thin film stress measurement systems are generally used to monitor film behavior that can affect pattern fidelity, adhesion, cracking, bow, and downstream integration.

How it works

General reference — not yet source-verified

Thin film stress tools commonly infer film stress from substrate curvature rather than by contacting the film mechanically. Thin film stress tools generally compare a substrate condition before and after a process step and convert the curvature change into a stress value through a film and substrate model.

Where it fits in the process flow

General reference — not yet source-verified

Thin film stress metrology is typically placed around deposition and thermal processing steps. Thin film stress metrology is commonly used after film formation and after thermal exposure to verify that the film stack remains within process limits before later patterning, etch, integration, or reliability work.

Applications

General reference — not yet source-verified

Thin film stress metrology is used wherever film mechanics influence yield, device behavior, or package interaction. Thin film stress metrology is relevant to metal films, dielectric films, barrier layers, and other deposited stacks whose thermal mismatch or intrinsic stress can affect subsequent processing.

What do the numbers mean?

Power & electrical7

Frequency
60 Hz[3]
Accurate?
Single Phase[3]
Accurate?
Voltage
115 V[3]
Accurate?
Voltage
230V[2]
Accurate?
Phase
Single Phase[1]
Accurate?
Power
60 Hz[1]
Accurate?
Voltage
115 V or 230 V[1]
Accurate?

Wafer handling2

Wafer sizes
8 inch[2]
Accurate?
Wafer size
8 inch[2]
Accurate?

Optics & imaging3

Dual Wavelength[3]
Accurate?
Wavelength mode
Dual Wavelength[3]
Accurate?
Optics
Dual Wavelength[1]
Accurate?

Configuration & options7

Phase
1 Phase[2]
Accurate?
15A[2]
Accurate?
LCD monitor[2]
Accurate?
OEM
KLA[1]
Accurate?
Model
FLX 2320[1]
Accurate?
Tool type
Thin Film Stress Measurement System[1]
Accurate?
Category
Metrology & Inspection[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Frequency60 Hz[3]
  • ConfigurationSingle Phase[3]
  • Voltage115 V[3]
  • Voltage230V[2]
  • PhaseSingle Phase[1]
  • Power60 Hz[1]
  • Voltage115 V or 230 V[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kind of equipment is the KLA FLX 2320?

The KLA FLX 2320 is a thin film stress measurement system used for metrology and inspection.[1][3][2]

How does the FLX 2320 measure film stress?

The FLX-2320 determines stress by measuring curvature change before and after film deposition and calculating stress by way of Stoney’s equation. The FLX stress measurement system uses the laser lever technique.[7][8]

Not publicly documented

The following facts about the FLX 2320 Thin Film Stress Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FLX 2320 Thin Film Stress Measurement are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the FLX 2320 Thin Film Stress Measurement are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the FLX 2320 Thin Film Stress Measurement are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FLX 2320 Thin Film Stress Measurement are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the FLX 2320 Thin Film Stress Measurement is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]Inventory photo
  7. [7]https://www.nanofab.utah.edu/wp-content/uploads/2022/12/Film-stress-Tencor-FLX2320-Spec-Sheet.pdf.pdf — nanofab.utah.edunanofab.utah.edu
  8. [8]https://tohotechnology.com/wp-content/uploads/2020/08/FLX-2320-R-Spec-Sheet-OFFICIAL.pdf — tohotechnology.comtohotechnology.com
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Last updated Oct 19, 2026.

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