Multitest

MT 9038

Research Quality: 40% complete

What it is

General reference — not yet source-verified

The Multitest MT 9038 belongs to the test and probe class of semiconductor equipment. Machines of this class are used to make temporary electrical contact to devices on a wafer or to individual die so that device behavior can be checked against expected electrical responses.

How it works

General reference — not yet source-verified

Machines of this class generally align the device to a contact structure, establish controlled electrical contact, and then apply programmed stimuli while measurement electronics observe the response. The contact may be made through probes or other temporary interfaces designed to touch bond pads, bumps, or designated test points without becoming part of the finished device.

Such systems typically combine motion control, alignment, contact force management, signal routing, and test sequencing. Software coordinates device indexing, test execution, data capture, pass fail determination, and output of binning or mapping information so downstream operations can distinguish acceptable devices from rejects or from parts requiring further review.

What do the numbers mean?

Wafer handling4

Hot test handler^[2]
Equipment type: Handler^[1]
Description: Hot test handler^[3]
Test mode: Hot test handler^[2]

Configuration & options13

AMB only In / Output for SO150/ 1.27^[1]; VIP Kelvin contact unit^[2]; SO8 HD Test^[2]; Capacity 53k/ day^[2]
Category: Test & Probe^[3]
Contact unit: VIP Kelvin contact unit^[3]
Test capability: SO8 HD test^[3]
Make: Multitest^[1]
Model: MT 9038^[1]; AMB only^[1]
In / Output: SO150/ 1.27^[1]
Test application: SO8 HD Test^[2]
Capacity: 53k/day^[2]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

How is probe testing different from final test?General reference — not yet source-verified

Probe testing is performed before permanent packaging is complete, typically while the device is still on the wafer or otherwise accessible at early form. Final test occurs later and verifies packaged devices through their finished external connections.

Not publicly documented

The following facts about the MT 9038 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MT 9038 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MT 9038 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MT 9038 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MT 9038 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MT 9038 is not on record.
Answerable by: an OEM datasheet or a fab qualification report