Nordson
BT 22 Bond Pull & Shear
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Nordson / Dage BT 22 Bond Pull & Shear Tester is a bond test instrument that evaluates the mechanical strength and integrity of wire bonds, solder joints, and other microelectronic connections. The Nordson BT 22 supports both wire shear and wire pull testing modes, allowing comprehensive evaluation of bond strength and reliability. The Nordson BT 22 features an intuitive touchscreen interface for easy test parameter setup, real-time data monitoring, and result analysis.[1]
What it is
The Nordson BT 22 Bond Pull & Shear is a microelectronics test instrument originally manufactured by Dage (later part of Nordson). The machine is designed to perform wire pull and wire shear testing to evaluate the mechanical strength of wire bonds, solder joints, and other microelectronic connections. The BT 22 supports both wire pull and wire shear testing modes, enabling comprehensive bond-strength and reliability assessment. The tester provides high precision and repeatability in force measurements, capturing data such as force-displacement curves, peak force values, and failure analysis information.[1]
How it works
The BT 22 applies and measures controlled forces to microelectronic bonds through interchangeable test fixtures. The instrument can operate in wire shear mode, where a tool shears the bond sideways, and wire pull mode, where a tool engages and pulls the wire loop upward. An intuitive touchscreen interface allows the operator to set test parameters and monitor real-time measurement data. The tester includes adjustable test speeds to optimize conditions for different bond configurations and materials. The machine integrates with dedicated software platforms for test programming, data management, report generation, and statistical analysis of results.[1]
Applications
The BT 22 is applicable to testing wire bonds, ribbon bonds, ball bonds, solder joints, adhesives, and other mechanical connections found in microelectronic assemblies. The tester is used across industries that manufacture electronic components, including semiconductor packaging, automotive electronics, medical devices, and telecommunications equipment. The instrument meets industry standards and regulations for bond testing equipment, supporting compliance with quality control and reliability requirements.[1]
What do the numbers mean?
Performance1
Control & software2
Configuration & options7
- Data Acquisition
- Captures and stores test data such as force-displacement curves, peak force values, and failure analysis information[1]
- Compatibility
- Compatible with a range of fixtures and accessories for testing various bond types, sizes, and configurations[1]
- Safety Features
- Overload protection, emergency stop functions, user-defined safety limits[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What testing modes does the BT 22 support?
The BT 22 supports both wire pull and wire shear testing modes for evaluating bond strength and reliability.[1]
What kind of user interface does the BT 22 have?
The BT 22 features an intuitive touchscreen interface for test parameter setup, real-time data monitoring, and result analysis.[1]
What types of bonds can the BT 22 test?
The BT 22 can test wire bonds, ribbon bonds, ball bonds, solder joints, adhesives, and other mechanical connections in microelectronic assemblies.[1]
What data does the BT 22 capture during testing?
The BT 22 captures force-displacement curves, peak force values, and failure analysis information.[1]
Does the BT 22 include software for data management?
The BT 22 integrates with dedicated software platforms for test programming, data management, report generation, and statistical analysis of test results.[1]
Not publicly documented
The following facts about the BT 22 Bond Pull & Shear are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BT 22 Bond Pull & Shear are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BT 22 Bond Pull & Shear are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BT 22 Bond Pull & Shear are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BT 22 Bond Pull & Shear are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BT 22 Bond Pull & Shear is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]microprecision.com — microprecision.commicroprecision.com
- [2]Equipment inventory listing
Last updated Sep 1, 2026.
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