OAI
Process applications and technology nodes documented for this tool.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the 808 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 808 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 808 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 808 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 808 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 808 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
ASML PAS 5500/300 is a deep-UV stepper photolithography tool configured for 4-inch wafers.
The GCA 6100 C Wafer Stepper is a lithography tool for 100 mm wafers with a 150 mm X/Y stage travel and an AWH1 automatic wafer handler.
The OAI Model 800 Mask Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with motorized backside focus, motorized auto leveling, and auto gap setting.
The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.