Waferpedia

OAI

808

Lithography100mmOAI 808 family
Research Quality: 30% complete
OAI808
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Wafer size

100mm

Performance

± 1.0µm 3σ[1]

Optics

4"x4"; 5"x5", 7"x7", and 9"x9"[1]

What is it?

The OAI 808 Aligner is described as the OAI Model 800 Mask Aligner, a semi-automated optical front- and backside mask aligner with four cameras. The source states motorized backside focus, motorized auto leveling, and auto gap setting, and lists wafer sizes, mask sizes, alignment accuracy, resolution, and exposure wavelength.

What can it run?

Process applications and technology nodes documented for this tool.

  • Lithography
  • Optical front-side and backside mask alignment

What do the numbers mean?

Vacuum & pumping1

Resolution
Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[1]
Accurate?

Optics & imaging3

Type
semi-automated, four-camera, optical front- and backside mask aligner[1]
Accurate?
Mask size
4"x4"; 5"x5", 7"x7", and 9"x9"[1]
Accurate?
Exposure wavelength
350 · ´50 nm[1]
Accurate?

Performance3

Top side alignment accuracy
± 1.0µm 3σ[1]
Accurate?
Bottom side alignment accuracy
± 1.25µm 3σ[1]
Accurate?
Large gap alignment accuracy
Option / ± 1.5µm 3σ[1]
Accurate?

Configuration & options3

Motorized features
motorized backside focus, motorized auto leveling, auto gap setting[1]
Accurate?
Size
2", 100mm, 150mm, 200mm pieces[1]
Accurate?
Mercury arc lamp
350 W[1]
Accurate?
Interested in this tool?
Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ResolutionVacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 808 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 808 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 808 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 808 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 808 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 808 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]cores.research.asu.educores.research.asu.educores.research.asu.edu
  2. [2]Equipment and rates | NanoFab | Core Facilities | ASUcores.research.asu.educores.research.asu.edu
  3. [3]https://cores.research.asu.edu/wp-content/uploads/2026/06/OAI-808-Aligner-Tool-Procedures-Rev-C_4-23-13.pdfcores.research.asu.educores.research.asu.edu
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Last updated Jul 29, 2026.

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