SUSS MicroTec
ACS200
The SUSS MicroTec ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists. The SUSS MicroTec ACS200 GEN3 can handle standard SEMI wafers of 100 mm and 150 mm diameter on request. The SUSS MicroTec ACS200 GEN3 includes two spin-coating modules and one development module with puddle and spray options.[1]
Plate 01ACS200 Gen3 TE Coater & Developer - Fully Automated Platform for Maximum Throughput
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What it is
The SUSS MicroTec ACS200 Gen3 is an automated coater and developer platform for wafer photolithography. The ACS200 Gen3 is positioned for both research and development and high-volume manufacturing. The ACS200 Gen3 processes wafers from 100 mm to 200 mm. The ACS200 Gen3 uses a modular cluster architecture and configurable 3M, 5M, and 6M frames.[5][7]
How it works
The ACS200 Gen3 supports configurable 3M, 5M, and 6M frames, with 2 or 4 I/O stations as standard or a continuous run load port. The ACS200 Gen3 uses SUSS GYRSET technology to create a turbulence-free, solvent-rich atmosphere during coating. The ACS200 Gen3 also uses a dispense system with integrated resist supply, self-calibration, closed-loop control, and a bubble sensor for dosing low- and high-viscosity materials.[5][7]
Applications
General reference — not yet source-verifiedCoater and developer systems are used wherever patterned photoresist films define later process areas on wafers or similar substrates. Typical uses include resist coating for etch masks, plating molds, implant masks, and lift-off patterns, as well as thick-film processing for packaging and micromechanical structures. The equipment class can also support process work on non-silicon substrates when compatible handling and chemistry are available.
- Coating
- Development
- Photolithography
What do the numbers mean?
Power & electrical3
Wafer handling19
- Loading/unloading ports
- Two loading/unloading ports: one cassette for coating and one cassette for development[1]
- Supported wafer materials
- Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[1]
- Wafer material
- Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[1]
- Wafer types
- opaque wafers such as silicon and SOI, or transparent wafers such as glass, fused-silica, and sapphire[1]
Gas & chemistry1
Configuration & options20
- Hotplates and coolplates
- Two stacks of hotplates (9 in total) and coolplates (3 in total)[1]
- Photoresists available
- AZ ECI 3007, AZ ECI 3027, AZ 10XT-20, AZ 10XT-60, AZ 15nXT, AZ 40XT[1]
- Thermal modules
- Two stacks of hotplates (9 in total) and coolplates (3 in total), including an additional HMDS-priming module[1]
- Thermal modules
- two stacks of hotplates (9 total) and coolplates (3 total), including an additional HMDS-priming module[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| ACS200 Gen3 TE | Gen3 | — | Further advanced version of the ACS200 Gen3 with higher throughput, future-ready options, and operation comfort for advanced packaging applications of tomorrow. | suss.com[6] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes can the ACS200 Gen3 handle?
The tool can handle standard SEMI wafers of 100mm and 150mm diameter on request.[1]
Does it include an HMDS-priming module?
Yes, the tool has an additional HMDS-priming module.[1]
How many spin-coating modules does it have?
The tool is equipped with two spin-coating modules.[1]
How are process sequences managed?
Sequences are stored in a database library organized into 10 sections of 1000 recipes. The flow is managed in real time by the software.[1]
Not publicly documented
The following facts about the ACS200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ACS200 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the ACS200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ACS200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ACS200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the ACS200 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
Last updated Oct 19, 2026.
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