Tokyo Electron
CleanTrack ACT 8
The Clean Track ACT 8 is an industry-standard wafer coater and developer. The Clean Track ACT 8 supports DUV lithography with an in-line exposure unit interface. The Clean Track ACT 8 is configured for 100 mm (4") wafers.[1]
Wafer size
100mm
Node / era
DUV lithography
Vacuum
4 for photoresist (COT), 2 for BARC (BCT)[1]
Performance
High throughput in a small footprint[1]
Gas delivery
TMA238WA[1]
What it is
General reference — not yet source-verifiedCoater and developer tracks prepare wafers for optical lithography by applying liquid films, carrying out bake steps, and developing exposed resist. Such equipment is typically paired with an exposure tool so that coating, baking, exposure handoff, and development occur in a coordinated lithography flow.
How it works
The CleanTrack ACT 8 is composed of three main blocks: the Carrier Station Block, the Process Block, and the Interface Block. The Carrier Station Block provides the cassette interface and uses a Carrier Robot Arm to shuttle wafers between cassettes and the Process Block. The Process Block contains spinning units and thermal plates. The spinning units include a Bottom-layer Coater for bottom antireflective coating, a Coater for photoresist spin, and a Developer for photoresist development. The Process Block also includes adhesion promoter plates for vapor-phase HMDS pretreatment, hot plates, chill plates, and precision hot plates for post-exposure bake. The Process Robot Arm transports wafers between modules. The tool also includes an automatic cup wash routine for cleaning the cup and splash ring in coating units.[1]
Inside the spinning units, the CleanTrack ACT 8 controls the process environment with laminar air flow at regulated temperature, humidity, and air velocity. The resist and developer temperatures are matched to the environment through water-jacketed lines. The motor flange temperature is controlled by water circulation to reduce heat transmission through the wafer chuck.[1]
What can it run?
Process applications and technology nodes documented for this tool.
- DUV lithography
- Photoresist coating
- Photoresist development
- Anti-reflective coating processing
- Post-exposure bake and related thermal processing
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Wafers going through the track must have a clean backside.
- Small particles can hinder printing of small features and/or contaminate the wafer stage for subsequent batches.
- Wafers with contaminated or dirty backsides should be removed from the batch.
- Wafer stage cleaning is described as delicate, complex, wearing, time-consuming, and requiring recalibration.
- Users liable of wafer stage contamination will be billed cleaning hours and may lose access to the machine.
- The source warns that using the wrong cassette type may put the carrier robot arm and wafers in serious danger.
What do the numbers mean?
Vacuum & pumping2
Wafer handling17
- Wafer size
- Interface Unit (IRA) for Canon FPA-3000 i5 stepper including one multi-buffer unit and Wafer edge exposure (WEE)[2]
Gas & chemistry12
Optics & imaging3
Performance4
- Thermal Plates
- Low-temperature Hot Plate, High-temperature Hot Plate, High-speed Chill Plate, ADHesion plates, Precision Hot Plates, Transition Station, Transition Chill Plate[1]
Control & software5
- Temperature/humidity control
- Internal laminar flow with regulated temperature, humidity, and cup temperature/humidity controller (T&H)[1]
Configuration & options15
- In-line with ASML PAS5500/350C stepper forming a DUV lithography cluster[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Cluster configurationCoater and developer track in-line with an ASML PAS5500/350C stepper[1]
- Process materialsKrF photoresist and ancillary anti-reflective coatings[1]
- Resist pump lines4 for photoresist (COT), 2 for BARC (BCT)[1]
- Developer lines2 pressure-driven lines[1]
- Developer usedTMA238WA[1]
- Solvent usedMicroposit EC Solvent (Dupont)[1]
- Spinning UnitsBottom-layer Coater (BCT), Coater (COT), Developer (DEV)[1]
- PhotoresistKrF photoresist (M108Y, M35G)[1]
- DeveloperTMA238WA[1]
- External ModulesAC Power Box, Chemical Cabinet, Temperature and Humidity Controller, Thermostatic Water Supply[1]
- Photoresist typesM108Y (JSR Corporation) and M35G[1]
- Chemical filtersULPA chemical filters[1]
- Photoresist chemistryKrF photoresist[1]
- Gas deliveryTMA238WA[7]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is the CleanTrack ACT 8 organized internally?
The CleanTrack ACT 8 is composed of three main blocks: the Carrier Station Block, the Process Block, and the Interface Block.[1]
Not publicly documented
The following facts about the CleanTrack ACT 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CleanTrack ACT 8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CleanTrack ACT 8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CleanTrack ACT 8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented compatible parts, consumables, or accessories for the CleanTrack ACT 8 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the CleanTrack ACT 8 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]c2mi.ca — c2mi.cac2mi.ca
- [7]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 19, 2026.
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