Rudolph

E25

Metrology & Inspection 300mm Rudolph E25 family

Research Quality: 40% complete

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E25 — web.archive.org — Fig. 01E25web.archive.org^[1]

Wafer size

300mm

Performance

Greater than 80 WPH^[1]

What is it?

The E25 System provides automated wafer edge top and edge normal inspection with throughput greater than 80 WPH for 300 mm wafers. It is described as a Class 1 certified system with an approximate 10 minute set-up time, and it can automatically detect and classify defects across the entire wafer edge using on-the-fly color defect image capture and intrinsic ADC capabilities.

What can it run?

Process applications and technology nodes documented for this tool.

Edge inspection
Incoming bare wafer
Lithography
Outgoing quality control
Thin films
Wafer bump
Wafer probe
Wafer saw

What do the numbers mean?

Wafer handling3

Inspection type: Automated wafer edge top and edge normal inspection^[1]
Wafer size: 300 mm^[1]
Detection and classification: Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel^[1]

Optics & imaging1

Illumination: Brightfield and darkfield illumination available^[1]

Performance1

Throughput: Greater than 80 WPH^[1]

Configuration & options3

Certification: Class 1 certified^[1]
Set-up time: Approximately 10 minutes to be fully optimized and production ready^[1]
Defect imaging: On-the-fly color defect image capture^[1]

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the E25 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the E25 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the E25 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the E25 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the E25 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the E25 is not on record.
Answerable by: an OEM datasheet or a fab qualification report