Waferpedia

Sonoscan

Gen-6

Metrology & Inspection300mmnew generationSonoscan Gen-6 family
Research Quality: 30% complete
SonoscanGen-6
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What is it?

The Sonoscan Gen-6 is described as a new generation in acoustic microscopy imaging with advanced Sonoscan capabilities including PolyGate, SonoSimulator, Virtual Rescanning Mode, and optional Frequency Domain Imaging. It uses a tower-referenced scan and fixtures, has an open-access scanning area, and is stated to scan from a single part to a 300mm wafer.

What can it run?

Process applications and technology nodes documented for this tool.

  • Nondestructive failure analysis
  • Process development
  • High-Rel qualification for a military application
  • Low/medium volume screening
  • Microelectronics
  • MEMS
  • SSL LEDs
  • Power modules
  • Solar
  • HighTech materials

What do the numbers mean?

Wafer handling1

Scan capacity
Capable of scanning JEDEC trays or a 300mm wafer[1]
Accurate?

Control & software2

Temperature control
Water recirculation and optional inline temperature control[1]
Accurate?
Analysis software
SonoSimulator for simplified analysis of stacked die parts[1]
Accurate?

Configuration & options8

Technology
PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions capable of single and multi-focus imaging[1]
Accurate?
Gates per channel
Up to 100 gates per channel[1]
Accurate?
Sampling rate
2 Gsps[1]
Accurate?
Scanner
Inertially Balanced Linear Motor Scanner[1]
Accurate?
Scan reference platform
Tower-mounted scan reference platform and sample fixture[1]
Accurate?
Scanning area
Open-access scanning area[1]
Accurate?
Data analysis
Digital Image Analysis (DIA) quantifies acoustic data and supports automatic accept/reject criteria[1]
Accurate?
Rescanning
Virtual Rescanning Mode (VRM) stores comprehensive data for complete analysis after the sample is no longer available[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Gen-6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gen-6 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Gen-6 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Gen-6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Gen-6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Gen-6 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]ncf.uic.eduncf.uic.eduncf.uic.edu
  2. [2]https://ncf.uic.edu/wp-content/uploads/sites/819/2022/04/Scanning-Acoustic-Microscope-Manual.pdfncf.uic.eduncf.uic.edu
  3. [3]Instruments and Services | Nanotechnology Core Facility | University of Illinois Chicagoncf.uic.eduncf.uic.edu
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Last updated Jul 29, 2026.

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