SCREEN
LA 820
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
SCREEN LA 820 is a rapid thermal processing (RTP) system. SCREEN LA 820 is used for rapid annealing of wafers up to 8 inches. SCREEN LA 820 supports 6" / 8" wafer size handling.[1]
What it is
The SCREEN LA 820 is a thermal and diffusion tool. The SCREEN/DNS LA 820 is a rapid thermal processing system for rapid annealing of wafers up to 8 inches. The LA 820 family is categorized as RTP.[1]
How it works
General reference — not yet source-verifiedRapid thermal processing tools heat a wafer quickly and then cool it in a controlled way so that a short thermal step can be applied without extending the overall thermal exposure more than needed. Rapid annealing in this equipment class is generally used to activate implanted dopants, repair implantation damage, densify or modify thin films, or stabilize interfaces after earlier deposition or implant steps. Single wafer thermal tools generally emphasize repeatable wafer temperature control and short cycle processing rather than long batch residence times.
Where it fits in the process flow
General reference — not yet source-verifiedRapid thermal processing tools are placed after wafer fabrication steps that leave the wafer needing a defined thermal treatment. Rapid thermal anneal commonly follows ion implantation, certain deposited film steps, or other processes that require a brief high temperature exposure to activate, densify, cure, or recondition the wafer surface and near surface structure. Subsequent process flow can include additional deposition, etch, lithography, or contact formation depending on the device sequence.
Applications
The SCREEN/DNS LA 820 is used for rapid annealing of wafers up to 8 inches.[1]
What do the numbers mean?
Wafer handling1
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the LA 820 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the LA 820 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the LA 820 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the LA 820 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the LA 820 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the LA 820 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]en.xinlisemi.comen.xinlisemi.com
- [3]Equipment inventory listing
Last updated Oct 16, 2026.
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