Opus 3

Test and probe systems are used to connect electrical test instrumentation to a wafer or other device under test through a probing interface. Machines of this class provide controlled positioning, signal routing, and measurement access so devices can be characterized while still on the wafer or in other early test states.

Such systems are part of the broader electrical verification toolset used in semiconductor production and evaluation. They are designed to support contact-based testing, data collection, and device screening without changing the device itself.

A test and probe system typically positions probes or probe cards over designated contact points on the device under test and establishes electrical contact under controlled motion. Once contact is made, the system interfaces with measurement electronics to apply signals, read responses, and determine whether the device meets expected electrical behavior.

The class generally combines precision motion, alignment, contact control, and measurement coordination. The probing stage must maintain repeatable alignment and stable contact while the test instruments perform continuity, functional, parametric, or diagnostic measurements.

This class of equipment is used during electrical test and characterization, often before assembly, packaging, or final qualification. It serves as an inspection and screening step that helps identify acceptable devices and isolate units that do not meet electrical requirements.

Machines of this class are used for wafer-level electrical testing, device characterization, parametric screening, and debug work in semiconductor development and manufacturing. They are also used wherever controlled probe contact is needed to measure pads, interconnects, or test structures on a device substrate.