Accretech
APM 90 A
The Accretech APM 90 A is a semiconductor prober for test and probe work. The Accretech APM 90 A uses a TSK hot chuck, a manually clamped 200 mm PC adapter, and an AVME 127 CPU. The Accretech APM 90 A supports 6-inch and 8-inch wafers.[1][2]
What it is
How it works
Where it fits in the process flow
The APM 90 A is used for chip probing and process control monitoring.[8]
Applications
What do the numbers mean?
Wafer handling4
Control & software1
Configuration & options7
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Signatone CM 210— Same function class: Test & Probe, nullCompare in depthsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of devices can this class of machine test?General reference — not yet source-verified
Machines of this class can test a wide range of semiconductor devices, including logic, memory, analog, and mixed-signal integrated circuits, as well as discrete components like diodes and transistors.
How does temperature control work in such systems?General reference — not yet source-verified
Many probing systems in this class incorporate a thermal chuck that can heat or cool the wafer over a controlled temperature range, enabling device characterization under specified thermal conditions.
What is the typical throughput of such a system?General reference — not yet source-verified
Throughput depends on factors like stepping speed, test time per device, and probe card configuration; class-level specifications are determined by the tester and handler integration.
Can this machine handle different wafer sizes?General reference — not yet source-verified
Probing systems of this class are typically designed to accommodate a range of wafer diameters, with stage travel and chuck size matched to the specific platform, though exact sizes are model-dependent.
Not publicly documented
The following facts about the APM 90 A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the APM 90 A are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the APM 90 A are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the APM 90 A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the APM 90 A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the APM 90 A is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]junr.com.cn — junr.com.cnjunr.com.cn
Last updated Oct 7, 2026.
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