SUSS MicroTec
The SUSS MA 6 / BA 6 Gen 2 Mask Aligner is a lithography mask aligner. The SUSS MA 6 / BA 6 Gen 2 Mask Aligner includes topside alignment and backside alignment. The SUSS MA 6 / BA 6 Gen 2 Mask Aligner uses UV400 splitfield optics for 365nm and 405nm exposure.[1]

Mask aligners are photolithography tools that align a photomask to a substrate and expose photosensitive resist with ultraviolet light. Mask aligners are used to transfer patterned layers during microfabrication on wafers and other flat substrates.
The SUSS MicroTec MA 6 BA 6 Gen 2 is capable of hard contact, soft contact, and vacuum contact with proper tooling. The SUSS MicroTec MA 6 BA 6 Gen 2 uses UV400 splitfield optics for exposure at three hundred sixty five nanometer and four hundred five nanometer wavelengths.[1]
Mask aligners sit in the lithography portion of a microfabrication flow after substrate preparation and photoresist coating. Mask aligners are used before resist development and before the downstream etch, deposition patterning, implantation, or lift off steps that rely on the transferred resist image.
Mask aligners are used for patterned resist exposure in semiconductor, microsystem, and related cleanroom fabrication. Mask aligners are suited to processes that use contact or proximity exposure for layer definition, including front side patterning and flows that need alignment to structures already formed on either side of the substrate.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The SUSS MicroTec MA 6 BA 6 Gen 2 supports backside alignment and topside alignment.[1]
The SUSS MicroTec MA 6 BA 6 Gen 2 is equipped with a Suss DVM6 microscope and UV400 splitfield optics.[1]
The SUSS MicroTec MA 6 BA 6 Gen 2 is capable of hard contact, soft contact, and vacuum contact with proper tooling.[1]
The following facts about the MA 6 BA 6 Gen 2 Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 6 BA 6 Gen 2 Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 6 BA 6 Gen 2 Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 6 BA 6 Gen 2 Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA 6 BA 6 Gen 2 Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA 6 BA 6 Gen 2 Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 17, 2026.
Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.