SUSS MicroTec

The MJB 3 product information states a splitfield microscope, Leica objectives, a 350W lamphouse with an Ushio USH-350DS Hg lamp, UV400 near UV optics, and a wavelength range of 350-450nm. The same product information gives a resolution of 0.6um and lists a 3 inch vacuum chuck and a 3x3 inch mask holder.[2]
Mask alignment and exposure occur in the front end of a lithography flow, after substrate preparation and resist coating and before resist development and later pattern transfer steps. The tool is used to define features on the substrate by optical exposure through a mask.
Mask aligners are used for lithographic patterning in microfabrication, especially where direct mask-to-substrate alignment and optical exposure are needed. They are commonly used for creating photoresist patterns on wafers and other flat substrates in semiconductor and related microdevice work.
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It is a mask aligner, a class of optical lithography machine that exposes photoresist through a patterned mask.
It transfers a mask pattern onto a resist-coated substrate so the pattern can be developed and used in later process steps.
A mask aligner uses direct mask-to-substrate alignment for exposure, while projection tools form the pattern through an optical imaging system.
It is used on flat substrates that can be coated with photoresist, including semiconductor wafers and other planar workpieces.
It is used for planar resist patterns that define later etch, deposition, or lift-off steps in microfabrication.
The following facts about the MJB 3 Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MJB 3 Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MJB 3 Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MJB 3 Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MJB 3 Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MJB 3 Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.