IP 750 EX

Test and probe systems of this class are used to make temporary electrical contact with semiconductor devices so their behavior can be measured before further processing. They combine precision positioning with test instrumentation and are built to align probe contacts with pads, bumps, or other test points on the device under test.

Such systems are part of the semiconductor test flow rather than the front-end patterning flow. They are used to screen devices, verify electrical continuity, and separate acceptable material from material that requires further review or rejection.

A machine in this class brings a probe assembly into controlled contact with the target device while test electronics apply signals and measure the response. The probe motion and contact force are controlled so that the device can be tested repeatedly with minimal damage to the contact surfaces.

The system typically coordinates positioning, signal routing, and measurement through a test program. It can support probing of individual sites in sequence, allowing electrical checks to be performed across many devices on a wafer or on other semiconductor carriers depending on the configuration of the class.

This class usually sits between wafer fabrication and downstream assembly or final test. It is used when electrical verification is needed before devices move into more costly process steps.

Machines of this class are used for parametric checks, continuity testing, leakage screening, and functional verification of semiconductor devices at wafer or die level. They are also used to support yield monitoring and process control by identifying failing sites early in the manufacturing flow.