Precio

The Precio series is a fully automatic wafer-probing platform. The series includes models that support wafer sizes from 100 mm to 300 mm. The Precio XL model uses linear motor stage technology and achieves XY probing accuracy of ±1.8 µm and Z probing accuracy of ±5.0 µm. Probing force options are 200 kg and 300 kg for the Precio XL. The Precio nano model achieves XY probing accuracy of ±0.8 µm with probing force options of 300 kg and 400 kg. The Precio octo model handles 150 mm and 200 mm wafers with XY probing accuracy of ±2.0 µm and a probing force of 60 kg.^[1][4][5]

The Precio series has XY accuracy and Z-axis control for stable contact. Optimum temperature control during test is achieved. The platform supports increased parallel die testing to improve throughput. The Precio XL includes optional high-speed probe mark inspection using TELPADS™-I and an Auto Leveling function for automatic probe card parallelism adjustment. The Precio octo adopts ultra-high speed indexing and a high-speed wafer exchange function. The Precio nano features improved XY accuracy and Z precision for stable contact under high load. The Precio series also offers the CoSMOz software option to calculate the optimum contact sequence.^[1][5]

Wafer probers are used in the wafer sort (test) stage of semiconductor manufacturing, after wafer fabrication and before dicing. In this step, each die on the wafer is electrically tested to identify known good dies. The prober interfaces with a tester to apply test patterns and measure responses. After probing, the wafer moves to dicing and assembly processes.

Wafer probers are used for parametric and functional testing of a wide range of semiconductor devices, including logic, memory, and analog integrated circuits.