Tokyo Electron
Telius SP 308 Trench
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Telius SP 308 Trench is a trench etch system manufactured by Tokyo Electron. The Telius SP 308 Trench accepts 12-inch wafers.[1][2]
What it is
How it works
General reference — not yet source-verifiedPlasma etch tools generally expose a wafer to reactive gas species under vacuum so that selected material is removed where a patterned mask leaves the surface open. Trench etch processes are typically tuned to favor directional removal so etched features extend downward with controlled sidewall shape while protected regions remain in place.
Where it fits in the process flow
General reference — not yet source-verifiedA trench etch system sits after pattern definition steps that create an etch mask on the wafer. A trench etch system sits before later operations such as mask removal, dielectric or conductor fill, planarization, or additional pattern transfer, depending on the device flow.
Applications
General reference — not yet source-verifiedTrench etch tools are used for processes that form recessed structures in semiconductor wafers. Trench etch processes support device features that rely on patterned cavities, isolation regions, or other etched topography that is later integrated with deposition and planarization steps.
What do the numbers mean?
Wafer handling2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the model designation of this tool?
The model designation is Telius SP 308.[2]
Not publicly documented
The following facts about the Telius SP 308 Trench are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Telius SP 308 Trench are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Telius SP 308 Trench are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Telius SP 308 Trench are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Telius SP 308 Trench are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Telius SP 308 Trench is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 20, 2026.
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