T 5375

Machines of this class are wafer-level test systems used to connect to devices on a wafer before singulation and packaging. They provide a controlled way to make temporary electrical contact to pads or structures so that devices can be measured while they are still in wafer form.

A test and probe system in this class typically integrates a probing mechanism, alignment functions, and measurement interfaces. Its purpose is to identify device behavior, sort wafers, and support process control by evaluating electrical characteristics early in manufacturing.

Such systems position a wafer and bring fine probe contacts into alignment with conductive features on the wafer surface. Once contact is established, the system routes signals between the device under test and external measurement equipment or built-in test electronics.

The class operates by repeating a contact, measure, and retract cycle across selected sites on the wafer. Control software coordinates positioning, contact verification, and data collection so that electrical results can be associated with specific die or test structures.

This class of equipment sits at the wafer test stage, after front-end device formation and before final assembly. It is used to screen, characterize, and classify devices while they remain on the wafer.

Machines of this class are used for wafer sort, parametric testing, characterization of device structures, and process monitoring. They are also used to verify electrical continuity, identify defective sites, and support yield management in semiconductor manufacturing.