Applied Materials
Centura 5200 Metal
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Applied Materials Centura 5200 Metal is a chemical vapor deposition (CVD) system used for depositing metal films in semiconductor manufacturing. The system supports 8-inch wafers.[2][3]
How it works
General reference — not yet source-verifiedDuring operation, the system maintains controlled vacuum and temperature conditions within each chamber. Precursor gases are mixed and introduced through the gas delivery system, and RF energy generates plasma to drive the chemical deposition reactions. The robot and loadlock minimize atmosphere exposure, enabling high throughput.
Applications
General reference — not yet source-verifiedTitanium nitride is applied as a diffusion barrier and wear-resistant coating in semiconductor devices. Titanium layers are used for electrical contacts and interconnects.
What do the numbers mean?
Wafer handling1
Gas & chemistry1
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- YES 1224 P— Same function class: Deposition, nullCompare in depthsource[2]
- Lam Research Concept Two Dual Sequel— Same function class: Deposition, nullCompare in depthsource[2]
- Lam Research Concept Three Speed— Same function class: Deposition, nullCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ProcessCVD (Chemical Vapor Deposition)[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Centura 5200 Metal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura 5200 Metal are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura 5200 Metal are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura 5200 Metal are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura 5200 Metal are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura 5200 Metal is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 12, 2026.
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The Yes 1224 P is a CVD (chemical vapor deposition) system.
Lam / Novellus Concept Three Speed is a CVD deposition system for 12-inch wafers.
The Lam Research (Novellus) Concept Two Dual Sequel is a chemical vapor deposition (CVD) system.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.