Vantage Radiance Plus RTP

The Applied Materials Vantage Radiance Plus RTP is a rapid thermal process system in the thermal and diffusion equipment class. The Applied Materials Vantage Radiance Plus RTP has 2 chambers.^[1][2]

The Applied Materials Vantage Radiance Plus RTP is configured with 2 chambers. The Applied Materials Vantage Radiance Plus RTP uses two 25-wafer ADOE FOUP load ports. The Applied Materials Vantage Radiance Plus RTP runs Factory Interface 5.3.^[1][2]

Rapid thermal processing systems sit in the wafer fabrication flow wherever a short thermal budget is needed after film deposition, ion implantation, or surface preparation. Rapid thermal processing systems are commonly placed between front end module steps that require activation, densification, interface formation, or other temperature-driven changes without the longer residence time of a batch furnace. Rapid thermal processing systems can also appear after cleans or preconditioning steps and before metrology, etch, or subsequent deposition, depending on the integration scheme.

Rapid thermal processing systems are used for short high temperature semiconductor processes such as annealing, contact or interface conditioning, film treatment, and other thermal steps where time at temperature is important. Thermal and diffusion tools of this class may support work on silicon wafers for logic, memory, power, analog, and research process development. Process results in this class are often aimed at changing dopant activation state, film properties, defect behavior, or interfacial chemistry.