ASML
PAS 5500 300 C
Wafer size
Wafer Alignment:
Performance
ATHENA+TIS 3X0 (Off Axis Alignment System)[1]
Optics
Resolution <0.25um[1]
What is it?
What do the numbers mean?
Wafer handling2
- Wafer Stage Type
- Air Bearing Exposure Stage 200mm, SiSiC Wafer Table (Can be set up to run 125-200mm wafers)[1]
Optics & imaging7
Performance1
- ATHENA+TIS 3X0 (Off Axis Alignment System)[1]
Control & software1
Configuration & options9
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- DUV Resist InformationDocumentcornell.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the PAS 5500 300 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS 5500 300 C are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PAS 5500 300 C are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PAS 5500 300 C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PAS 5500 300 C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PAS 5500 300 C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
- [3]ASML: Products - Special Applications - Pre-Owned systems - PAS 5000/55 i-line Stepper — asml.com (Jan 25, 2006)web.archive.org
Last updated Jul 29, 2026.
Compare with similar tools
View all →
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
