Cascade Microtech
Summit 12862
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedProbers of this class position a wafer on a precision stage and bring a set of microscopic probe needles into contact with test pads on the die. The system allows the tester to measure electrical characteristics such as resistance, capacitance, and transistor parameters while the die is still in wafer form.
How it works
General reference — not yet source-verifiedThe Summit 12862 moves a wafer underneath a probe card containing many fine needles. A microscope and camera system allow the operator to visually align the probes to the test pads. The stage steps the wafer from die to die so that each device can be tested sequentially.
Contact between the probe needles and the wafer pads creates an electrical path from the die to the test instrumentation. The prober maintains precise planarity and z-axis control to avoid damaging the wafer or the probes. The system accommodates both manual and automated probing routines.
Where it fits in the process flow
General reference — not yet source-verifiedData collected by the prober may feed into a wafer-mapping system that marks known-good die for subsequent packaging and rejects defective die. The prober is an essential tool for both engineering characterization and high-volume manufacturing test.
Applications
General reference — not yet source-verifiedThe Summit 12862 is used for DC and low-frequency parametric testing of semiconductor devices. Applications include process development monitoring, reliability testing, and failure analysis.
What do the numbers mean?
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Summit 12862?
The Summit 12862 is a wafer prober.[1]
Not publicly documented
The following facts about the Summit 12862 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Summit 12862 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Summit 12862 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Summit 12862 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Summit 12862 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Summit 12862 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 1, 2026.
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