Electroglas
EG 6000
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Electroglas EG 6000 is a wafer prober.[1]
What it is
How it works
General reference — not yet source-verifiedA microscope and alignment system locate fiducial marks on the wafer to align the probe tips to the bond pads of each die.
Where it fits in the process flow
General reference — not yet source-verifiedThe EG 6000 is used in the wafer sort or final test stage after all front-end fabrication steps are complete.
Upstream process steps include photolithography, deposition, etch, and planarization; downstream steps include dicing, die attach, and packaging.
Applications
General reference — not yet source-verifiedWafer probers like the EG 6000 are used to test integrated circuits, memory devices, and other semiconductor products for functionality and parametric performance before dicing.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Non functional
What do the numbers mean?
Wafer handling5
- With chiller and material handler[2]
Configuration & options5
- Non functional[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is a test and probe system used for?General reference — not yet source-verified
It is used to make electrical contact with wafer-level structures so their electrical behavior can be measured and evaluated.
What does this class of machine measure?General reference — not yet source-verified
It measures electrical properties of devices, circuits, and test structures, including functional response and parametric behavior.
Where does wafer probing fit in semiconductor manufacturing?General reference — not yet source-verified
It is a wafer-level inspection and test step used before later assembly or further downstream processing decisions.
Why is precise motion important in this equipment class?General reference — not yet source-verified
Precise motion is needed to align the probes with small electrical pads or features and to repeat that contact consistently across many sites.
What kinds of tasks are done with probe equipment?General reference — not yet source-verified
It is used for wafer sort, device characterization, process control measurements, and evaluation of test structures.
Not publicly documented
The following facts about the EG 6000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 6000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EG 6000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EG 6000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the EG 6000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EG 6000 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]web.archive.org — electroglas.com (Aug 16, 2007)web.archive.org
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
Last updated Oct 13, 2026.
Compare with similar tools
View all →The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.