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Laurell

H6-8

Spin coater200mmLaurell H6-8 family
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H6-8 — web.archive.org
Fig. 01H6-8web.archive.org[1]

Wafer size

200mm

Power

95 to 240VAC, 47/63HZ, ~300 Watts[3]

Gas delivery

Solvent, Base or Acid-based processing[1]

What is it?

The Laurell H6-8 is described as a compact spin coater with advanced features, designed for glove box installation. Source materials state that it is a 650-series HL coater system, that it accommodates up to 200mm wafers and 7" × 7" (178mm × 178mm) substrates, and that it reaches a maximum rotational speed of 12,000 RPM based on a 100mm silicon wafer.

What can it run?

Process applications and technology nodes documented for this tool.

  • Coating
  • Etching
  • Developing
  • Rinsing-Drying
  • Cleaning
  • Glove box installation

What do the numbers mean?

Power & electrical1

Power
95 to 240VAC, 47/63HZ, ~300 Watts[3]
Accurate?

Vacuum & pumping1

Vacuum
25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[3]
Accurate?

Wafer handling3

Maximum rotational speed
12,000 RPM (based on a 100mm silicon wafer)[3]
Accurate?
Substrate capacity
Up to 7" × 7" (178mm × 178mm) substrates[3]
Accurate?
Wafer capacity
Up to 200mm wafers[3]
Accurate?

Gas & chemistry2

N2 process/seal purge
60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[3]
Accurate?
Typical process use
Solvent, Base or Acid-based processing[1]
Accurate?

Configuration & options1

Series
650-series HL coater system[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
H6-8B———web.archive.org[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power95 to 240VAC, 47/63HZ, ~300 Watts[3]
  • N2 process/seal purge60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[3]
  • Vacuum25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[3]
  • Typical process useSolvent, Base or Acid-based processing[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes does the H6-8 handle?

It accommodates up to 200 mm wafers and 7 inch by 7 inch substrates.[3][1][2]

What is the maximum rotational speed?

The maximum rotational speed is 12,000 RPM, based on a 100 mm silicon wafer.[3][1][2]

What processes are supported?

The supported processes are coating, etching, developing, rinsing-drying, and cleaning.[3][1][2]

Is PC software required to run the H6-8?

No. Spin 3000 can be used with the controller, but it is not required to program or run the equipment.[3][1][2]

Not publicly documented

The following facts about the H6-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the H6-8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the H6-8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the H6-8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the H6-8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the H6-8 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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