Waferpedia

Nikon

NSR S 203 B

LithographyNikon NSR S 203 family
Research Quality: 50% complete
NSR S 203 B — Inventory photo
Fig. 01NSR S 203 BInventory photo[1]

Vacuum

(2) HDD, Pumps, Chillers, Abatement[5]

Performance

6.00%[3]

Optics

248 nm[2]

What it is

The Nikon NSR S 203 B is a semiconductor lithography stepper or scanner used for photolithography on 8-inch wafers.[2][3][6]

How it works

General reference — not yet source-verified

A lithography stepper or scanner projects a patterned image through an optical system onto a photoresist-coated wafer. The exposure transfers circuit patterns in repeated fields across the wafer, using precise alignment and focus control to define features for later etch or deposition steps.

Where it fits in the process flow

General reference — not yet source-verified

This machine sits in the front end of semiconductor manufacturing, after wafer preparation and photoresist coating and before pattern transfer steps such as etching or implantation. Its role is to create the patterned resist image that defines the next process level.

Applications

General reference — not yet source-verified

This type of lithography tool is used for photolithographic patterning in semiconductor device fabrication, where a resist image is formed on the wafer before subsequent pattern transfer.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • HDD removed
  • Missing parts: (2) HDD, pumps, chillers, abatement
  • Excluded: hard drives (2)
  • Pumps, chillers, and abatement are excluded

What do the numbers mean?

Vacuum & pumping1

(2) HDD, Pumps, Chillers, Abatement[5]
Accurate?

Wafer handling4

Handler System
WL Type 3[1]
Accurate?
Factory Interface
Open Cassette[1]
Accurate?
(1) Open cassette[5]
Accurate?
Handler
WL Type 3[3]
Accurate?

Optics & imaging2

248 nm[2]
Accurate?
Lens Flare
8.50%[3]
Accurate?

Performance1

Uniformity
6.00%[3]
Accurate?

Control & software1

Software Version
MCSV[1]
Accurate?

Configuration & options16

CIM
SECS[1]
Accurate?
Excluded
Hard Drives (2)[1]
Accurate?
Process
Scanner[2]
Accurate?
Cymer ELS 5410[5]
Accurate?
(1) WL Type 3[5]
Accurate?
Missing parts:[5]
Accurate?
Cymer ELS 6400[5]
Accurate?
Process
Photolithography[3]
Accurate?
HDD removed[3]
Accurate?
IU Flare
0.84%[3]
Accurate?
Power
541 mW/cm2[3]
Accurate?
Total Focus Deviation
0.202 µm[3]
Accurate?
Astigmatism
0.119 µm[3]
Accurate?
Coma
0.040 µm[3]
Accurate?
ISO DOF
0.275 µm[3]
Accurate?
IU Flare
1.80%[6]
Accurate?
Interested in this tool?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration(2) HDD, Pumps, Chillers, Abatement[5]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What kind of equipment is the Nikon NSR S 203 B?General reference — not yet source-verified

It is a lithography system used to transfer circuit patterns onto a photoresist-coated substrate.

What does a lithography system do in semiconductor manufacturing?General reference — not yet source-verified

It exposes selected areas of photoresist with a patterned optical image so later process steps can form the desired circuit geometry.

Where is this class of machine used in the process flow?General reference — not yet source-verified

It is used during patterning, after resist coating and before development and downstream material-removal or material-formation steps.

Why is alignment important for this class of tool?General reference — not yet source-verified

Alignment ensures that each new patterned layer is placed correctly relative to previously formed structures on the wafer.

What kinds of structures are made with this class of equipment?General reference — not yet source-verified

It is used to define fine features that become semiconductor devices, interconnects, and other precision patterned elements.

Not publicly documented

The following facts about the NSR S 203 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSR S 203 B are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the NSR S 203 B are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the NSR S 203 B are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the NSR S 203 B is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the NSR S 203 B are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]Equipment inventory listing
  8. [8]Nikon Precision Incnikonprecision.com (May 15, 2006)web.archive.org
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Last updated Jul 29, 2026.

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