P 8 XL

A test and probe system is a wafer-level inspection and measurement platform used to make electrical contact with devices while they remain on the wafer. Machines of this class combine precise positioning, contact hardware, and test electronics so individual sites can be assessed without first separating the die.

Such systems are used in semiconductor manufacturing and development to identify functional devices, collect electrical data, and separate passing from failing sites. They are part of the broader metrology and test equipment set that supports process control and product qualification.

Machines of this class move a probe assembly or wafer stage so fine probe contacts can land on bond pads, test pads, or other exposed conductive features. Once contact is established, the system routes signals between the device under test and measurement instrumentation to apply stimuli and read responses.

The class typically relies on accurate alignment, controlled contact force, and repeatable motion to ensure stable electrical connection. The resulting measurements can include basic continuity checks, functional screening, and other device-level electrical evaluations performed while the wafer remains intact.

This class usually sits after front-end wafer fabrication steps and before dicing, packaging, or final device-level qualification. It is used while the product is still in wafer form so defective sites can be identified early in the flow.

Machines of this class are used for wafer acceptance testing, process monitoring, parametric measurement, and screening of integrated circuits and other semiconductor devices. They are also used in product development and process engineering to verify electrical behavior at the wafer level.