YES

Process applications and technology nodes documented for this tool.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
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It supports image reversal bake, vapor prime, and vacuum bake.[1]
The operation temperature ranges from ambient to 180 °C.[1]
It handles wafers up to 300 mm.[1]
It uses NH3 vapor to allow the creation of negative images using a positive photo-resist.[1]
The following facts about the 58TA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 58TA are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 58TA are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 58TA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 58TA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 58TA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.