Waferpedia

YES

12-2P-CP

Thermal / Diffusion300mmYES 12-2P-CP family
Research Quality: 30% complete
LinkedIn X Email
YES12-2P-CP
No photo available yet

Wafer size

300mm

Vacuum

10-6[1]

What is it?

The sources describe the YES-PB Series as a manual-load high-temperature cure oven for MEMS and semiconductor process applications. The 12-2P-CP configuration is listed under the series as a 300 mm wafer option. The sources also state that the series is used for applications such as polyimide/PBO cure, BCB bake, copper anneal, low-k dielectric cure, copper oxide removal, and aluminum anneal.

What can it run?

Process applications and technology nodes documented for this tool.

  • polyimide/PBO cure
  • BCB bake
  • low temp polymers cure
  • copper anneal
  • low-K dielectric cure
  • copper oxide removal
  • aluminum anneal
  • polyimide bake
  • dehydration bake
  • wirebond preparation
  • plasma cleaning

What do the numbers mean?

Vacuum & pumping1

High vacuum
10-6[1]
Accurate?

Wafer handling1

Wafer size
300 mm wafers[1]
Accurate?

Control & software1

Interface
touch screen interface[3]
Accurate?

Configuration & options7

Model designation
12-2P-CP[1]
Accurate?
Series
YES-PB Series / 450PB Series[1]
Accurate?
Load type
manual load[2]
Accurate?
Application scope
MEMS and semiconductor process applications[3]
Accurate?
Cooling package
Air-only cooling package; no water[1]
Accurate?
Airflow
Vertical laminar airflow[1]
Accurate?
Maximum temperature
up to 450°C[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES 6-2P-CP——Listed as a related spec option for 150 mm wafers.web.archive.org[1]
YES 8-2P-CP——Listed as a related spec option for 200 mm wafers.web.archive.org[1]
YES 12-2P-CP——Listed as a related spec option for 300 mm wafers.web.archive.org[1]
Interested in this tool?
Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • High vacuum10-6[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 12-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 12-2P-CP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 12-2P-CP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 12-2P-CP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 12-2P-CP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 12-2P-CP are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
Was this page accurate?

Last updated Jul 29, 2026.

Compare with similar tools

View all →
300 Bake PlateCEE

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

CategoryThermal / DiffusionWafer300mm
3 specs
12-2P-CP vs 300 Bake Plate →
450 PB 12 PolyimideYES

The Yes 450 PB 12 Polyimide Bake Oven is a batch process bake oven with capacity for two 25-wafer cassettes and 300mm FOUPs.

CategoryThermal / DiffusionWafer300mm
20 specs
12-2P-CP vs 450 PB 12 Polyimide →
58TAYES

The YES-58TA is a vacuum bake, HMDS vapor prime, and image reversal system that uses NH3 vapor for image reversal processing.

CategoryThermal / DiffusionWafer300mm
5 specs
12-2P-CP vs 58TA →
AST-1100Despatch
CategoryThermal / DiffusionWafer300mm
13 specs
12-2P-CP vs AST-1100 →
PB12YES
CategoryThermal / DiffusionWafer300mm
5 specs
12-2P-CP vs PB12 →
PBV-300YES
CategoryThermal / DiffusionWafer300mm
4 specs
12-2P-CP vs PBV-300 →