Process vertical
CoWoS Advanced Packaging Equipment
Chip-on-Wafer-on-Substrate (CoWoS) is TSMC's 2.5D integration platform that stacks HBM alongside logic dies on a silicon interposer. Producing CoWoS packages requires front-end-like lithography, bonding, and inspection tools. This page covers the lithography, bonding, and metrology equipment required for CoWoS and similar advanced packaging processes.
Required equipment categories
The following equipment categories are required for CoWoS and 2.5D advanced semiconductor packaging equipment. Each link opens the full catalog for that category.
Find tools in the catalog
Search the Waferpedia catalog for specific tool models, OEM brands, and wafer sizes relevant to CoWoS and 2.5D advanced semiconductor packaging equipment.