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Compound Semiconductor Fabrication Equipment
Compound semiconductor fabrication for GaAs, InP, GaN, and SiC devices requires MOCVD/MBE epitaxy, specialized etch, and compound-safe wet processing. III-V and IV-IV materials are reactive and require chemistries and chamber materials that differ from standard silicon fabs. This page covers the equipment categories and top tools for compound semiconductor manufacturing.
Required equipment categories
The following equipment categories are required for Compound semiconductor fabrication equipment: GaAs, InP, GaN, SiC. Each link opens the full catalog for that category.
Find tools in the catalog
Search the Waferpedia catalog for specific tool models, OEM brands, and wafer sizes relevant to Compound semiconductor fabrication equipment: GaAs, InP, GaN, SiC.