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HBM Packaging and High-Bandwidth Memory Equipment
High Bandwidth Memory (HBM) packaging stacks DRAM dies with through-silicon vias (TSVs) and copper pillars. TSV formation, wafer thinning, and precision bonding require a dedicated equipment set distinct from standard DRAM production. This page covers the TSV drilling, wafer thinning, bonder, and inspection tools required for HBM2, HBM3, and HBM4 manufacturing.
Required equipment categories
The following equipment categories are required for HBM and TSV-based memory packaging equipment. Each link opens the full catalog for that category.
Find tools in the catalog
Search the Waferpedia catalog for specific tool models, OEM brands, and wafer sizes relevant to HBM and TSV-based memory packaging equipment.