Process vertical
MEMS Fabrication Equipment
Microelectromechanical systems (MEMS) fabrication combines bulk micromachining, surface micromachining, and wafer bonding to create sensors, actuators, and microfluidic devices. Deep reactive-ion etch (DRIE), anodic bonding, and conformal deposition are process pillars. This page covers the specialized etch, deposition, bonding, and metrology tools used in MEMS manufacturing.
Required equipment categories
The following equipment categories are required for MEMS and microelectromechanical systems fabrication equipment. Each link opens the full catalog for that category.
Find tools in the catalog
Search the Waferpedia catalog for specific tool models, OEM brands, and wafer sizes relevant to MEMS and microelectromechanical systems fabrication equipment.