Tool family
Lam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Lam 2300 Etch Chamber | — | 2023 | Described as an etch chamber with 8-inch and 12-inch wafer sizes, 3 chambers, and included subsystems/software. | Equipment inventory listing[1] |
| Lam 2300 | — | 2019 | Listed as 12-inch equipment with KIYO EXP MRT. | Equipment inventory listing[2] |
| Lam 2300, 12" KIYO EXP MRT | — | 2019–2019 | Described as a 12-inch unit with KIYO EXP MRT. | Equipment inventory listing[2] |
| Lam 2300, 12" | — | 2016–2016 | Described as a 12-inch unit. | Equipment inventory listing[3] |
Lam 2300 e 5 Exelan Flex EX is an etcher for 12-inch wafers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
Lam 2300 Exelan Flex 45 Dielectric Etcher is a single-chamber etching system with a homemade manual load lock and 12 gas lines.
Lam 2300 Flex 45 is an etcher identified with metal high-productivity wet strip (HP MWS) use and a three-chamber configuration.
The Lam 2300 Kiyo GX RIE is a reactive ion etcher described with Poly, Corvus Tx, 6-channel, polysilicon film type, and 4 FOUP ports.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Lam 2300 V 2 Kiyo 45 Etcher - Polysilicon - 4ch - SiCl4 / BCl3 / HBr / CH4 / CHF3 / Cl2 / CH2F2 / CH3F / NF3 / O2 / CF4 / He / Ar / N2 - Edwards STP XA2703CV 2008 Vintage | — | 2008 | Listed with polysilicon, 4ch, the gas set, Edwards STP XA2703CV, and 2008 vintage. | Equipment inventory listing[4] |
| Lam 2300 V 2 Kiyo 45 Etcher - Polysilicon - 4ch - SiCl4 / BCl3 / HBr / CH4 / CHF3 / Cl2 / CH2F2 / CH3F / NF3 / O2 / CF4 / He / Ar / N2 - Edwards STP XA2703CV 2007 Vintage | — | 2007 | Listed with polysilicon, 4ch, the gas set, Edwards STP XA2703CV, and 2007 vintage. | Equipment inventory listing[5] |
| Lam 2300 V 2 Kiyo 45 Etcher - Polysilicon - 4ch - SiCl4 / BCl3 / HBr / CH4 / CHF3 / Cl2 / CH2F2 / CH3F / NF3 / O2 / CF4 / He / Ar / N2 - Edwards STP XA2703CV 2009 Vintage | — | 2009 | Listed with polysilicon, 4ch, the gas set, Edwards STP XA2703CV, and 2009 vintage. | Equipment inventory listing[6] |
| Lam 2300 V 2 Kiyo 45 Etcher | — | 2007–2007 | Listed with an Edwards STP XA2703CV pump and described as 2007 vintage. | Equipment inventory listing[5] |
General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.
Lam 2300 e 5 Exelan Flex EX is an etcher for 12-inch wafers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
Lam 2300 Exelan Flex 45 Dielectric Etcher is a single-chamber etching system with a homemade manual load lock and 12 gas lines.
Lam 2300 Flex 45 is an etcher identified with metal high-productivity wet strip (HP MWS) use and a three-chamber configuration.
The Lam 2300 Kiyo GX RIE is a reactive ion etcher described with Poly, Corvus Tx, 6-channel, polysilicon film type, and 4 FOUP ports.