Lam Research
2300 Exelan Flex
The Lam 2300 Exelan Flex is an etch chamber for semiconductor wafer processing. The Lam 2300 Exelan Flex is designed for 300 mm (12 inch) wafers.[1][2]
What it is
General reference — not yet source-verifiedEtchers are semiconductor process tools that remove selected material from a wafer after a patterned mask has defined where removal should occur. Etch tools are used to transfer lithographic patterns into films and underlying layers during device fabrication.
How it works
General reference — not yet source-verifiedEtch tools process wafers by exposing the wafer surface to reactive process conditions that remove material from areas opened by prior patterning. Etch tools are used to control material removal so that a pattern formed earlier in the flow is carried into the target layer.
Where it fits in the process flow
General reference — not yet source-verifiedEtchers are used after a pattern has been formed on the wafer by lithography and related pattern transfer preparation. Etchers are followed by downstream steps such as resist removal, cleaning, metrology, and additional deposition or patterning, depending on the device sequence.
Applications
General reference — not yet source-verifiedEtch tools are applied where semiconductor fabrication requires selective removal of thin films or substrate material in patterned areas. Etch tools support the formation of features such as openings, trenches, and other transferred structures used in integrated device manufacturing.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the Lam 2300 Exelan Flex support?
The Lam 2300 Exelan Flex supports wafers with a 12-inch diameter.[1]
What are the electrical specifications of the Lam 2300 Exelan Flex?
The Lam 2300 Exelan Flex operates on 208 VAC at 50/60 Hz, with a full load current of 56 A and a main circuit breaker rating of 70 A.[3]
Not publicly documented
The following facts about the 2300 Exelan Flex are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Flex are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 Exelan Flex are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 Exelan Flex are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 Exelan Flex are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 Exelan Flex is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]CN101131928A - Triple Resist Organic Layer Etching - Google Patents — patents.google.compatents.google.com
Last updated Oct 18, 2026.
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