Alcatel
AMS 200 SE
Power
3 kW at 13.56 MHz[1]
Vacuum
3 to 15 mbar[1]
Gas delivery
SF6 and C4F8 can be used in pulsed mode[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Silicon etching
- Silicon-on-insulator etching
- Dielectric etching
- Isotropic silicon release etching
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The equipment is not microelectronic compatible.
- Borosilicate (Pyrex) and sodalime (floatglass) wafers can be loaded only with a backside conductive layer.
- For fused silica, Pyrex, and float glass wafers, a conductive backside layer is required because of the electrostatic clamping chuck.
What do the numbers mean?
Power & electrical3
- Wafer biasing modes
- RF (13.56 MHz) for dielectric etching and pulsed Low Frequency (LF) for silicon etching[1]
Vacuum & pumping2
Wafer handling4
- Wafer cooling / clamping
- Electrostatic Clamping Chuck (ESC) controlled in temperature for wafer cooling[1]
Gas & chemistry2
Optics & imaging1
Control & software1
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| AMS200 | — | — | Referenced as the AMS200 system and described as the same equipment in the source text. | epfl.ch[1] |
What replaced it?
Related models
- siblingSTS Multiplex ICP— Listed in the same etching equipment section.source[1]
- siblingSPTS Rapier— Listed in the same etching equipment section.source[1]
- siblingSPTS Synapse— Listed in the same etching equipment section.source[1]
- siblingSPTS APS— Listed in the same etching equipment section.source[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Maximum ICP RF power3 kW at 13.56 MHz[1]
- He backside pressure range3 to 15 mbar[1]
- Wafer biasing modesRF (13.56 MHz) for dielectric etching and pulsed Low Frequency (LF) for silicon etching[1]
- Maximum substrate holder bias power600 W pulsed LF or 500 W RF[1]
- PumpingAdixen 1600 l/s turbo pump plus Adixen ADP122 rough pump[1]
- Gas lines7 mass flow controllers and 6 gases: SF6, C4F8, CH4, O2, Ar, He[1]
- Bosch process gasesSF6 and C4F8 can be used in pulsed mode[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the AMS 200 SE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AMS 200 SE are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the AMS 200 SE are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the AMS 200 SE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AMS 200 SE are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the AMS 200 SE are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
Last updated Jul 29, 2026.