Canon
The Canon FPA 3000 i 5 + Fine Pattern Aligner is a step-and-repeat lithography tool. The Canon FPA 3000 i 5 + Fine Pattern Aligner processes 6-inch wafers.[1][2]

The Canon FPA 3000 i 5 + Fine Pattern is a mask aligner for semiconductor lithography.[1]
A mask aligner positions a photomask over a wafer so patterned light can transfer features into a light sensitive coating.
A mask aligner in this class is used to register the mask to existing wafer features before exposure.
A mask aligner sits in the lithography portion of semiconductor fabrication.
A mask aligner is used after the wafer has received a photoresist coating and before the exposed pattern is developed and transferred into later process layers.
A mask aligner is used for photolithographic patterning of semiconductor wafers.
A mask aligner is used when a process flow needs aligned exposure of fine patterns on the wafer surface.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The Canon FPA 3000 i 5 + Fine Pattern is a mask aligner for semiconductor lithography.[1]
The following facts about the FPA 3000 i 5 + Fine Pattern are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the FPA 3000 i 5 + Fine Pattern are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FPA 3000 i 5 + Fine Pattern is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 13, 2026.
The SUSS MA 150 CC Mask Aligner is a mask aligner with cassette-to-cassette operation and wafer sizes from 2 to 6 inches.
The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.
The SUSS MA 6 Mask Aligner is a semiconductor lithography tool used for mask alignment and exposure, supporting various wafer sizes and featuring infrared alignment and a split-field microscope.
The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.