Heidelberg Instruments
VPG200
The Heidelberg Instruments VPG200 is a laser pattern generator that produces masks, direct exposes resist on SEMI-standard wafers, and fabricates mask reticles for DUV steppers. The VPG200 uses a 355 nm pulsed Q-switched DPSS laser and achieves a critical dimension of 0.6 µm with its 4 mm focal length write head. The VPG200 supports substrates up to 7 inch x 7 inch square or 200 mm diameter.[1]
Wafer size
100mm
Node / era
600 nm minimum resolution with thin photoresist (< 1 µm)
Optics
500 nm[1]
Control era
Linux workstation
What it is
The Heidelberg Instruments VPG200 is a laser pattern generator. The Heidelberg Instruments VPG200 produces masks for use with mask aligners, performs direct exposure of resist on SEMI-standard wafers, and fabricates mask reticles for DUV steppers. The Heidelberg Instruments VPG200 supports CAD-generated layouts in cif, gdsii, dxf, and gerber formats. The Heidelberg Instruments VPG200 can process masks and reticles in 4, 5, 6, and 7 inch formats, and wafers in 100 mm and 150 mm SEMI-standard cassette handling. The Heidelberg Instruments VPG200 supports maximum substrates up to 7 inch by 7 inch square or 200 mm diameter.[1][2]
How it works
The Heidelberg Instruments VPG200 exposes resist with a focused 355 nm UV laser beam from a pulsed Q-switched DPSS laser. The Heidelberg Instruments VPG200 reconstructs images by projection of two linear arrays of 1000 pixels combined with mechanical movement of the stage. The Heidelberg Instruments VPG200 uses stage position control with interferometers and a vacuum chuck for various substrate sizes. The Heidelberg Instruments VPG200 includes real-time autofocus. The Heidelberg Instruments VPG200 includes macro and micro cameras behind the same projection optics for manual or automatic detection of alignment markers, with top-side alignment support.[1][2]
Where it fits in the process flow
General reference — not yet source-verifiedLaser pattern generators write patterns into resist on masks or substrates. Laser pattern generators sit in the lithography flow where a design must be transferred before development and pattern transfer. Mask writing feeds later exposure work on contact or proximity aligners, while direct writing on wafers can support process development, overlay work, and low volume patterning without a separate mask set.
Applications
The Heidelberg Instruments VPG200 is used to produce masks for mask aligner use, to directly expose resist on SEMI-standard wafers, and to fabricate mask reticles for DUV steppers. The Heidelberg Instruments VPG200 supports single exposure, batch processing, and multi-design or parameter mapping. The Heidelberg Instruments VPG200 supports overlay exposure on an existing pattern with top-side alignment only. The Heidelberg Instruments VPG200 supports batch processing up to 20 5 inch masks or 25 wafers.[1][2]
- Produce masks for use with maskaligner
- Direct exposure of resist on SEMI-standard wafers
- Produce mask reticules for the DUV stepper
- Overlay exposure on an existing pattern (top side alignment only)
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Sensitive to airborne solvent contamination on optical elements
- SU8 thicker than 50 µm without manual edge bead removal will contaminate nozzle and internal optics
- Exposure of AZ10XT at any thickness is forbidden to avoid resist particles projection directly on the front lens
- Overlay exposure with top side alignment requires precise wafer flat pre-alignment with a maximum tolerance of ± 10 mrad
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling11
- Supported substrates
- Masks and reticules (4, 5, 6, 7 inch) and wafer (100 and 150 mm SEMI-standard) cassette station[1]
- Substrate handling
- Cassette station for masks and reticles (4, 5, 6, 7 inch) and wafers (100 and 150 mm SEMI-standard)[1]
- Substrate handling
- Masks and reticules (4, 5, 6, 7 inch) and wafer (100 and 150mm SEMI-standard) cassette station; batch processing up to 20 5" masks or 25 wafers[1]
- Alignment
- 2 cameras: macro and micro for manual or automatic detection of alignment markers (top side only); overlay exposure with top side alignment requires wafer flat pre-alignment with maximum tolerance of ±10 mrad[1]
Gas & chemistry2
- Resolution (minimum)
- Approximately 600 nm with thin photoresist (< 1 µm) for 4 mm write head[1]
Optics & imaging21
Dimensions & facilities5
Configuration & options12
- Imaging method
- Projection of two linear arrays of 1000 pixels combined with mechanical stage movement[1]
- Writing time (5 inch x 5 inch square, with handling)
- 7 min (4 mm head), 18 min (10 mm head), 65 min (20 mm head)[1]
- Image reconstruction
- Projection of two linear arrays of 1000 pixels combined with mechanical movement of the stage[1]
- Writing time with handling (5"x5" sq. 110x110 mm)
- 7, 18, 65 min for 4, 10, 20 mm write heads[1]
- Image reconstruction
- Projection of two linear arrays of 1000 pixels combined with mechanical stage movement[1]
Vintage & configurations
Control-system eraLinux workstation[1]
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| VPG200 with 4 mm Write Head | — | — | Critical dimension 0.6 µm, pattern edge roughness max 90 nm, alignment accuracy < 300 nm | epfl.ch[1] |
| VPG200 with 10 mm Write Head | — | — | Critical dimension 0.9 µm, pattern edge roughness max 140 nm, alignment accuracy < 400 nm | epfl.ch[1] |
| VPG200 with 20 mm Write Head | — | — | Critical dimension 2.0 µm, pattern edge roughness max 250 nm, alignment accuracy < 800 nm | epfl.ch[1] |
What replaced it?
Related models
- siblingHeidelberg Instruments MLA150— The source mentions the MLA150 as another Heidelberg laser writer installed in the CMi clean room; the Himt convert interface is similar for both. The MLA150 is mentioned as an alternative for exposing AZ10XT at 405 nm, which is forbidden on the VPG200.source[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Stage systemPosition control with interferometers, chuck with vacuum for various substrate sizes[1]
- Resolution (minimum)Approximately 600 nm with thin photoresist (< 1 µm) for 4 mm write head[1]
- Stage systemStage system, position control with interferometers, chuck with vacuum for various substrate sizes[1]
- ResolutionMinimum about 600 nm with thin photoresist thickness (<1 µm)[1]
- TypeVolume Pattern Generator (laser pattern generator)[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Conversion ManualManualepfl.ch
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What exposure source does the Heidelberg Instruments VPG200 use?
The Heidelberg Instruments VPG200 uses a 355 nm wavelength pulsed Q-switched DPSS laser.[1][2]
What substrate sizes can the Heidelberg Instruments VPG200 accept?
The Heidelberg Instruments VPG200 supports masks and reticles in 4, 5, 6, and 7 inch formats and wafers in 100 mm and 150 mm SEMI-standard cassette handling. The maximum substrate size is 7 inch by 7 inch square or 200 mm diameter.[1][2]
What write head options are available on the Heidelberg Instruments VPG200?
The Heidelberg Instruments VPG200 has 3 interchangeable write heads with focal lengths of 4 mm, 10 mm, and 20 mm.[1][2]
What layout file formats does the Heidelberg Instruments VPG200 support?
The Heidelberg Instruments VPG200 supports cif, gdsii, dxf, and gerber design formats.[1][2]
What alignment capability does the Heidelberg Instruments VPG200 provide?
The Heidelberg Instruments VPG200 uses macro and micro cameras for manual or automatic detection of alignment markers. The Heidelberg Instruments VPG200 supports overlay exposure on an existing pattern with top-side alignment only.[1][2]
Not publicly documented
The following facts about the VPG200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the VPG200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented compatible parts, consumables, or accessories for the VPG200 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]VPG200 — Heidelberg Instruments | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 20, 2026.
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