Heidelberg Instruments
VPG200
Wafer size
100mm
Optics
500 nm[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Produce masks for use with maskaligner
- Direct exposure of resist on SEMI-standard wafers
- Produce mask reticules for the DUV stepper
- Overlay exposure on an existing pattern (top side alignment only)
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Sensitive to airborne solvent contamination on optical elements
- SU8 thicker than 50 µm without manual edge bead removal will contaminate nozzle and internal optics
- Exposure of AZ10XT at any thickness is forbidden to avoid resist particles projection directly on the front lens
- Overlay exposure with top side alignment requires precise wafer flat pre-alignment with a maximum tolerance of ± 10 mrad
What do the numbers mean?
Vacuum & pumping1
- Stage system
- Position control with interferometers, chuck with vacuum for various substrate sizes[1]
Wafer handling3
- Supported substrates
- Masks and reticules (4, 5, 6, 7 inch) and wafer (100 and 150 mm SEMI-standard) cassette station[1]
Optics & imaging7
- Alignment cameras
- 2 cameras: macro and micro for manual or automatic detection of alignment markers (top side only)[1]
Dimensions & facilities1
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Stage systemPosition control with interferometers, chuck with vacuum for various substrate sizes[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Conversion ManualManualepfl.ch
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the VPG200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the VPG200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the VPG200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the VPG200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the VPG200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the VPG200 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
Last updated Jul 29, 2026.
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