Oxford Instruments
Plasmalab 80 Plus RIE
Wafer size
8"
Power
50/60 Hz[1]
Vacuum
30 - 100 Mtorr[1]
Performance
5 - 10 % range[3]
Gas delivery
100 sccm[1]
What it is
General reference — not yet source-verifiedThe Oxford Instruments Plasmalab 80 Plus RIE is an etch tool in the reactive ion etch class. Such systems are used for controlled dry removal of films and patterned layers from a substrate surface.
Machines of this class combine plasma generation with directional ion bombardment to support pattern transfer in semiconductor and microfabrication workflows. They are used where etch shape, selectivity, and repeatability matter more than simple bulk material removal.
How it works
General reference — not yet source-verifiedA reactive ion etch system creates a low-pressure plasma from process gases inside a chamber. The plasma produces chemically active species that react with exposed material while electric fields accelerate ions toward the surface to make the etch more directional.
The balance between chemical reaction and physical ion assistance allows the machine class to etch selected materials, open patterned features, and control sidewall profile. Process conditions are adjusted to match the material being removed and the pattern transfer goal.
Where it fits in the process flow
General reference — not yet source-verifiedThis class of machine is used after patterning steps such as lithography and resist development, when the exposed material must be removed from selected regions. It is typically part of the front-end or microfabrication sequence where features are defined into films or device layers.
Applications
General reference — not yet source-verifiedReactive ion etch systems are generally used for semiconductor fabrication, MEMS work, thin-film patterning, and other precision microfabrication tasks. They are also used for material research and process development where controlled dry etching is required.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Missing one 15 V power supply (needed to work)
What do the numbers mean?
Power & electrical7
Vacuum & pumping5
- Pumps Down[4]
Wafer handling2
- PECVD Tested for 2" - 4" wafers[3]
Gas & chemistry3
Performance1
Control & software1
- HDD & Software Included[1]
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Lam Research Rainbow 4520— Same function class: Etch, 8"Compare in depthsource[5]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration50/60 Hz[1]
- Voltage415 VAC, 3 Phase[1]
- Full Load Amps25.6 A[1]
- Max Flow Rate Per Gas100 sccm[1]
- RF Generator300 Watt 13.56 MHZ[1]
- Typical Process Pressure30 - 100 Mtorr[1]
- Pumping SystemCorrosion Resistant Turbo Molecular Pump with Rotary Pump[1]
- Available Gases in ChamberAr, CF4, O2, CHF3, SF6, & He[1]
- Phase3 Phase[2]
- Available gas in the chamberAr, CF4, O2, CHF3, SF6 & He.[2]
- RF generator300 Watt 13.56MHz[2]
- Typical process pressure30 – 100 mtorr[2]
- Pumping systemCorrosion-resistant turbo-molecular pump with rotary pump[2]
- ConfigurationPumps Down[4]
- ConfigurationMissing one 15 V Power Supply (needed to work)[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Plasmalab 80 Plus RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 80 Plus RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 80 Plus RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 80 Plus RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Plasmalab 80 Plus RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Plasmalab 80 Plus RIE are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]inventory listing
- [4]inventory listing
- [5]allwin21.comallwin21.com
- [6]University-of-Utah-94-721002-System-Manual — nanofab.utah.edunanofab.utah.edu
- [7]Oxford Plasmalab 80 Plus | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
- [8]PECVD System Manual - Maryland University 94-219896 .pdf — nanocenter.umd.edunanocenter.umd.edu
Last updated Jul 29, 2026.
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Lam Research Rainbow 4520 is a single-wafer plasma/RIE etching system described as part of the Rainbow 45XX series.
General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.