Lam Research
Rainbow 4520
The Lam Rainbow 4520 is a fully automated, in-line, single-wafer plasma/RIE etching system. The Lam Rainbow 4520 processes 6-inch or 8-inch wafers. The Lam Rainbow 4520 is part of the Lam Rainbow 45XX Series, which is mainly for oxide etch.[1]
Plate 01Lam Research Rainbow 4420 4520 4620 4720 4428 4528 4628 Plasma Etch Semiconductor Equipment
Peter ChenWatch on YouTubePlate 02Lam Research Lam Rainbow 4400 4500 4600 4420 4520 4620 4720 plasma etcher semiconductor equipment
SemiStarWatch on YouTubePlate 03Upgrade Kit for Lam Rainbow 4400 4500 4600 4700 4420 4520 4620 4720 Plasma Etcher RIE
Allwin21Watch on YouTube
Wafer size
8"
Power
≤5% of set points[1]
Vacuum
≤ 5 mT[1]
Performance
± 1 ℃[1]
Gas delivery
1-6 or 1-8 lines with MFC; maximum 9 lines[1]
What is it?
Applications
The Lam Research Rainbow 4520 proven applications include contact oxide etch with high selectivity to polysilicon, anisotropic via etch with N2 addition, oxide spacer etch, photoresist/oxide etchback planarization, SOG/oxide etchback planarization, tapered contact etch, in situ soft etch, anisotropic dielectric etch, and silicon nitride etch.[1][2]
- Oxide etch
- Contact oxide etch
- Anisotropic via etch
- Oxide spacer etch
- Photoresist/oxide etchback planarization
- SOG/oxide etchback planarization
- Tapered contact etch
- In situ soft etch
- Anisotropic dielectric etch
- Silicon nitride etch
What do the numbers mean?
Power & electrical7
- RF Match
- Unique RF match networks located at upper and lower electrodes for programmable switching between plasma and RIE modes[1]
- Thermal Output
- Etcher: 3.4K carried by water, 3.4k by exhaust, 7k dispersed; RF Cart: 7K carried by water, 7k dispersed; TCU: 4K carried by water, 1k dispersed[1]
Vacuum & pumping4
Wafer handling10
Gas & chemistry5
Performance1
Control & software3
Dimensions & facilities2
Configuration & options20
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Lam Rainbow 45XX Series | — | — | Series described as a fully automated, in-line, single-wafer plasma/RIE etching system with programmable switching between plasma and RIE modes. | allwin21.com[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Oxford Instruments Plasmalab 80 Plus RIE— Same function class: Etch, 8"Compare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Gases1-6 or 1-8 lines with MFC; maximum 9 lines[1]
- RF MatchUnique RF match networks located at upper and lower electrodes for programmable switching between plasma and RIE modes[1]
- Number of Gases1-6 or 1-8 lines MFC, maximum 9 lines[1]
- Typical GasesAr, CF4, CHF3, He, SF6, N2, NF3 (process dependent)[1]
- Base Pressure≤ 5 mT[1]
- MFC/RF/DC Precision≤5% of set points[1]
- Particle (Bare-Si, RF-Off)< 50 @0.3um[1]
- Power208V, 50/60Hz, 3 phase, 5 wires, WYE, 30A(Max), 23(Norm) for Etcher[1]
- Physical Dimensions (RF Cart)22"W x 32"D x 44"H, 250 lbs[1]
- ExhaustEtcher Cabinet: Draw CFM 300, H2O 0.5, House, 4 inch Duct; Etcher Gas Panel: Draw CFM 75, H2O 0.5, Scrubbed, possible hazard, 2 inch Duct[1]
- Cooling WaterR.F. Cart: 2±0.2 GPM, 85±5 PSI, 14~35°C, 3/8" ID fittings, <200 u; TCU: 6±0.5 GPM, 11~26°C, 1/2" ID fittings, <200 u[1]
- Nitrogen40±10 PSI and 90±10 PSI, CDA can also be used for R.F. Cart[1]
- Thermal OutputEtcher: 3.4K carried by water, 3.4k by exhaust, 7k dispersed; RF Cart: 7K carried by water, 7k dispersed; TCU: 4K carried by water, 1k dispersed[1]
- Process Gases1/4" VCR fittings, <0.05u filter[1]
- Gas delivery1-6 or 1-8 lines with MFC; maximum 9 lines[2]
- Particle performanceBare-Si, RF-Off < 50 @0.3um[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Lam Research Rainbow 4520 process?
The Lam Research Rainbow 4520 processes 6-inch or 8-inch wafers.[1][2]
Is the Lam Research Rainbow 4520 a fully automated system?
The Lam Research Rainbow 4520 is a fully automated, in-line, single-wafer plasma/RIE etching system. The Lam Research Rainbow 4520 is computer-controlled and allows either manual or automatic control.[1][2]
Not publicly documented
The following facts about the Rainbow 4520 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rainbow 4520 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Rainbow 4520 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rainbow 4520 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rainbow 4520 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Rainbow 4520 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]allwin21.com — allwin21.comallwin21.com
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 20, 2026.
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