Nikon
NSR 2205 i 12 D
What it is
General reference — not yet source-verifiedThe NSR 2205 i 12 D sits in the photolithography portion of semiconductor manufacturing, where patterned exposure transfers circuit features onto a wafer using a mask, optical alignment, and precision stage motion.
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe tool belongs early in wafer fabrication, before etch, implant, deposition, and other downstream pattern-transfer steps. It is used after resist coating and alignment preparation, and before the exposed pattern is developed and transferred into the underlying film stack.
Applications
General reference — not yet source-verifiedEquipment of this class is used for patterning integrated circuits, discrete devices, and other microfabricated structures on silicon wafers. It is also used wherever precise repeatable optical transfer of a circuit layer is needed in semiconductor manufacturing.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is a test and probe system used for?General reference — not yet source-verified
It is used to make controlled electrical contact with semiconductor devices or test structures so they can be measured, verified, and classified before later manufacturing steps.
What does the probing part do?General reference — not yet source-verified
The probing part brings conductive contacts into alignment with the target pads or nodes and maintains a stable connection long enough for electrical measurements to be taken.
What kinds of measurements does this class support?General reference — not yet source-verified
Such systems support electrical checks such as continuity, leakage, functional response, and other parametric measurements depending on the device and test setup.
Where is this equipment used in semiconductor manufacturing?General reference — not yet source-verified
It is typically used at wafer-level or other pre-package test stages, as well as in engineering and process development environments.
Not publicly documented
The following facts about the NSR 2205 i 12 D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSR 2205 i 12 D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSR 2205 i 12 D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSR 2205 i 12 D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSR 2205 i 12 D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSR 2205 i 12 D is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
- [8]Used Equipment | Nikon Precision | Global Site — nikonprecision.com (Mar 25, 2015)web.archive.org
Last updated Jul 29, 2026.
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