Oxford Instruments
Plasmalab 80 Plus
Plate 01Plasmalab 80 Plus RIE
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SemiStarWatch on YouTubePlate 03Oxford Plasmalab 80 Plus PECVD System (ID# 3908)
ClassOneEngineeringWatch on YouTubePlate 04Oxford PlasmaLab 80+ Video Guide
Yale University CleanroomWatch on YouTubePlate 05Oxford PlasmaLab 80 Plus RIE PECVD Semiconductor equipment ~8 inch
SemiStarWatch on YouTubePlate 06Plasmalab 80 Plus RIE System
Bid ServicellcWatch on YouTubePlate 07Oxford Plasmalab 80 Plus RIE / PE Etcher (ID# 3859)
ClassOneEngineeringWatch on YouTubePlate 08Oxford Plasmalab 80 Plus RIE PE Etcher ID# 3859
TechnolutionsWatch on YouTubePlate 09Video 1 - Oxford Plasmalab 80 Plus RIE System (ID# 3559)
ClassOneEngineeringWatch on YouTubePlate 10Oxford Plasmalab 80 Plus PECVD System (ID# 3864)
ClassOneEngineeringWatch on YouTubePlate 11Video 1 - Oxford Plasmalab 80 Plus RIE System (ID# 3751)
ClassOneEngineeringWatch on YouTubePlate 12Video 1 Oxford Plasmalab 80 Plus RIE System ID# 3751
TechnolutionsWatch on YouTube
What it is
The Oxford Instruments Plasmalab 80 Plus is a reactive ion etching system used for plasma-based etch processing. It is a compact, open-loading tool intended for research, prototyping, and low-volume production, and it can handle wafer pieces as well as wafers up to two hundred millimeters in diameter.[1][6]
How it works
General reference — not yet source-verifiedReactive ion etching uses a plasma to generate reactive species and directed ion bombardment, allowing material to be removed in a controlled way. An open-loading chamber lets wafers or pieces be placed in the process area without a fully enclosed automated cassette transfer sequence.
Where it fits in the process flow
General reference — not yet source-verifiedIn a nanofabrication flow, this type of system sits after pattern definition and before downstream cleaning, inspection, or device completion steps. It is used when patterned material must be etched with controlled shape and depth rather than simply deposited or cleaned.
Applications
The Plasmalab 80 Plus is used for reactive ion etching on materials processed with fluorine-based chemistries. The named process gases include CF4, Ar, O2, SF6, and CHF3.[1][6]
- Reactive ion etching
- Research and development
- Small-scale production
- Prototyping
- Low-volume production
What do the numbers mean?
Power & electrical1
Wafer handling1
Gas & chemistry1
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Plasma-Therm 720/740— Same function class: Etch, 200mmCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Oxford-Plasmalab-80plus-Cloey-SOP-Rev-D.pdfSOPasu.edu
- Oxford-Plasmalab-80plus-Rev-C-Floey.pdfDocumentasu.edu
- Oxford PECVD Plasmalab 80Plus Standard Operating ProcedureSOPtamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Plasmalab 80 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 80 Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 80 Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 80 Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 80 Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 80 Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (11)Every fact above is drawn from these public sources
- [1]nano.upenn.edu — nano.upenn.edunano.upenn.edu
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Oxford Plasmalab 80 Plus | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
- [7]PlasmaLab M80 Plus – Chlorine - Core Research Facilities — cores.research.asu.educores.research.asu.edu
- [8]Oxford Plasmalab80Plus (PECVD) - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
- [9]Physical Vapor Deposition — nanolab.berkeley.edunanolab.berkeley.edu
- [10]University-of-Utah-94-721002-System-Manual — nanofab.utah.edunanofab.utah.edu
- [11]PECVD System Manual - Maryland University 94-219896 .pdf — nanocenter.umd.edunanocenter.umd.edu
Last updated Jul 29, 2026.
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