Plasma-Therm
720/740
Wafer size
200mm
Gas delivery
chlorine and fluorine based chemistry[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- etching metals and dielectrics
- etching 2D materials such as MoS2, WSe2, NbSe2, AsSe2, and GaSe
- etching perovskites such as SrRuOx, SrLaAlOx, and BaSrOx
What do the numbers mean?
Wafer handling2
Gas & chemistry1
Optics & imaging1
Configuration & options1
- right chamber designation
- 720 (right chamber), designated for chlorine and fluorine based etching of 2D materials and perovskites[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Oxford Instruments Plasmalab 80 Plus— Same function class: Etch, 200mmCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- chemistrychlorine and fluorine based chemistry[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the PlasmaTherm Versaline Deep Silicon Etcher?
It is a dry etching system configured for deep silicon etching.[1]
What process is it configured to use?
It is configured for fast switching Bosch processes.[1]
What materials does it etch?
It is used for etching silicon wafers.[1]
What structures can it create?
It can create high aspect ratio trenches and channels in silicon wafers.[1]
Not publicly documented
The following facts about the 720/740 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 720/740 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 720/740 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 720/740 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 720/740 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 720/740 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]cnf.cornell.edu — cnf.cornell.educnf.cornell.edu
- [2]nano.upenn.edunano.upenn.edu
Last updated Jul 29, 2026.
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