SUSS MicroTec
MA / BA Gen4 Pro Series
The MA / BA Gen4 Pro Series is a semi-automated system for mask and bond alignment and exposure. The MA / BA Gen4 Pro Series supports wafers up to 150 mm / 200 mm. The MA / BA Gen4 Pro Series offers UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.[1]
How it works
The system supports multiple processes including exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation. The integration of these capabilities into a single tool enables flexible processing without the need for separate equipment. The system's architecture is designed to handle wafers up to 200 mm in diameter.[1]
What can it run?
Process applications and technology nodes documented for this tool.
- Proximity lithography
- Wafer bonding
- Micro- and nanoimprinting
What do the numbers mean?
Wafer handling1
Optics & imaging2
Performance1
Configuration & options5
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| BA8 Gen4 Pro | Gen4 | — | Also available as BA8 Gen4 Pro configuration | hilpert.ch[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Karl Suss MA6— Same function class: Lithography, 150mmCompare in depthsource[2]
Related models
- siblingSUSS MicroTec BA8 Gen4 Pro— The series includes both MA and BA configurations; BA8 Gen4 Pro is a specific configurationsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the MA / BA Gen4 Pro Series support?
The MA / BA Gen4 Pro Series supports wafer sizes up to 150 mm and 200 mm.[1]
What processes can the MA / BA Gen4 Pro Series perform?
The system performs mask and bond alignment, exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.[1]
Is the MA / BA Gen4 Pro Series automated or manual?
The MA / BA Gen4 Pro Series is a semi-automated system.[1]
Not publicly documented
The following facts about the MA / BA Gen4 Pro Series are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA / BA Gen4 Pro Series are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA / BA Gen4 Pro Series are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA / BA Gen4 Pro Series are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA / BA Gen4 Pro Series is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA / BA Gen4 Pro Series are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
- [2]ncf.uic.eduncf.uic.edu
Last updated Sep 22, 2026.
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