Waferpedia

Karl Suss

MA6

Lithography150mm1 micron and better; 0.6 µm under optimum conditions in vacuum modei-lineKarl Suss MA6 family
Research Quality: 80% complete
MA6 — ncf.uic.edu
Fig. 01MA6ncf.uic.edu[1]
  • Plate 01Karl Suss MA6 Mask Aligner - Standard Operating Procedures

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  • Plate 02Exposure using contact aligner (Suss MA6)

    Micro System Integration Center(uSIC), Tohoku UnivWatch on YouTube
  • Plate 03Karl Suss MA6 Mask Aligner Part 2

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  • Plate 04Karl Suss MA6 BSA Mask Aligner

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  • Plate 05Video 1 of 2 - Karl Suss MA6/BA6 Mask Aligner (ID# 3733)

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  • Plate 06Aligner: MA6 - 2 Part I (Operation) at DTU's cleanroom facility - Nanolab

    DTU NanolabWatch on YouTube
  • Plate 07Karl Suss MA6 - Backside and Topside Alignment

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  • Plate 08Karl Suss MA6 Mask Aligner

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  • Plate 09Karl Suss MA6 Mask Aligner 7-26-13

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Wafer size

150mm

Node / era

1 micron and better; 0.6 µm under optimum conditions in vacuum mode

Performance

0.5 µm[1]

Optics

Channel 1 (405 nm) and Channel 2 (365 nm)[1]

What it is

The Karl Suss MA6 is a photolithography mask aligner used to transfer patterns from photomasks onto photoresist-coated substrates. It is a high resolution semi-automated tool intended for research and development and small volume production.[1]

How it works

The tool uses ultraviolet exposure to transfer mask patterns to resist on the substrate. Its alignment system includes a splitfield microscope for fiducial alignment, storage and automatic movement between reference points, and bottom-side alignment for aligning backside features to the photomask.[1]

Applications

The MA6 is used in semiconductor research, MEMS development, microfluidics, and optical component production.[1]

  • semiconductor research
  • MEMS-development
  • microfluidics
  • optical component production

What do the numbers mean?

Vacuum & pumping2

Resolution
0.6 µm under optimum conditions in vacuum mode[1]
Accurate?
Exposure modes
proximity, soft contact, hard contact, and vacuum[1]
Accurate?

Wafer handling3

Substrate range
5 x 5 mm dies to wafers up to 150 mm[1]
Accurate?
Maximum substrate thickness
6 mm[1]
Accurate?
Wafer chucks available
3, 4, 6 inch[1]
Accurate?

Optics & imaging3

Wavelength channels
Channel 1 (405 nm) and Channel 2 (365 nm)[1]
Accurate?
Mask holders available
4, 5, 7 inch[1]
Accurate?
Objectives
5X, 10X, and 20X[1]
Accurate?

Performance2

Top side alignment precision
0.5 µm[1]
Accurate?
Alignment features
Splitfield microscope with storage and automatic movement between reference points; Bottom-Side Alignment (BSA); Wedge Error Compensation (WEC)[1]
Accurate?

Configuration & options1

Light source
Broadband Hg lamp[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
MA4The MA6 and MA4 Mask Aligners use UV light to transfer patterns from photomasks onto substrates coated with photoresist; the MA6 is listed with wafers up to 6 inches while the MA4 is listed with wafers up to 4 inches.ece.utoronto.ca[4]
MA6/BA6Front and backside alignment capabilities are stated for the MA6/BA6 mask aligners.louisville.edu[5]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Resolution0.6 µm under optimum conditions in vacuum mode[1]
  • Exposure modesproximity, soft contact, hard contact, and vacuum[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What substrate sizes can the MA6 handle?

It can handle irregularly shaped substrates ranging from 5 x 5 mm dies to wafers up to 150 mm.[1]

What illumination wavelengths are specified?

The tool uses a broadband Hg lamp with channel 1 at 405 nm and channel 2 at 365 nm.[1]

What applications is it used for?

It is used in semiconductor research, MEMS development, microfluidics, and optical component production.[1]

Not publicly documented

The following facts about the MA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the MA6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MA6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the MA6 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (13)Every fact above is drawn from these public sources
  1. [1]ncf.uic.eduncf.uic.eduncf.uic.edu
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]ece.utoronto.caece.utoronto.caece.utoronto.ca
  5. [5]louisville.edulouisville.edulouisville.edu
  6. [6]Equipment Resources | CNFcnf.cornell.educnf.cornell.edu
  7. [7]Lithography Recipes - UCSB Nanofab Wikiwiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  8. [8]Suss MA6 Mask Aligner (system 2)tmi.utexas.edutmi.utexas.edu
  9. [9]Tool Details - Harvard CNScns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
  10. [10]Frontside/Backside Mask Aligner | Shared Materials Instrumentation Facilitysmif.pratt.duke.edusmif.pratt.duke.edu
  11. [11]User Manualepfl.chepfl.ch
  12. [12]Karl Suss MA6 Aligner | UCLA Nanolabnanolab.ucla.edunanolab.ucla.edu
  13. [13]Mask/bond aligner:front/back capable [SUSS-align] | Quantum-Nano Fabrication and Characterization Facility | University uwaterloo.cauwaterloo.ca
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Last updated Jul 29, 2026.

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