Karl Suss

Plate 01Karl Suss MA6 Mask Aligner - Standard Operating Procedures
Plate 02Exposure using contact aligner (Suss MA6)
Plate 03Karl Suss MA6 Mask Aligner Part 2
Plate 04Karl Suss MA6 BSA Mask Aligner
Plate 05Video 1 of 2 - Karl Suss MA6/BA6 Mask Aligner (ID# 3733)
Plate 06Aligner: MA6 - 2 Part I (Operation) at DTU's cleanroom facility - Nanolab
Plate 07Karl Suss MA6 - Backside and Topside Alignment
Plate 08Karl Suss MA6 Mask Aligner
Plate 09Karl Suss MA6 Mask Aligner 7-26-13
Wafer size
150mm
Node / era
1 micron and better; 0.6 µm under optimum conditions in vacuum mode
Performance
0.5 µm[1]
Optics
Channel 1 (405 nm) and Channel 2 (365 nm)[1]
The Karl Suss MA6 is a photolithography mask aligner used to transfer patterns from photomasks onto photoresist-coated substrates. It is a high resolution semi-automated tool intended for research and development and small volume production.[1]
The tool uses ultraviolet exposure to transfer mask patterns to resist on the substrate. Its alignment system includes a splitfield microscope for fiducial alignment, storage and automatic movement between reference points, and bottom-side alignment for aligning backside features to the photomask.[1]
The MA6 is used in semiconductor research, MEMS development, microfluidics, and optical component production.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MA4 | — | — | The MA6 and MA4 Mask Aligners use UV light to transfer patterns from photomasks onto substrates coated with photoresist; the MA6 is listed with wafers up to 6 inches while the MA4 is listed with wafers up to 4 inches. | ece.utoronto.ca[4] |
| MA6/BA6 | — | — | Front and backside alignment capabilities are stated for the MA6/BA6 mask aligners. | louisville.edu[5] |
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
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It can handle irregularly shaped substrates ranging from 5 x 5 mm dies to wafers up to 150 mm.[1]
The tool uses a broadband Hg lamp with channel 1 at 405 nm and channel 2 at 365 nm.[1]
It is used in semiconductor research, MEMS development, microfluidics, and optical component production.[1]
The following facts about the MA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No publicly documented compatible parts, consumables, or accessories for the MA6 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
The GCA 6300 DSW is a g-line wafer stepper used for lithography, with source descriptions also identifying related i-line GCA 6300 stepper documentation.