Tegal

Wafer size
100mm
Node / era
down to 90nm
Process applications and technology nodes documented for this tool.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 6540 HRe | — | — | Same 6540 line name used for a version described as a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement; wafer size stated as 100mm–200mm and optimized down to 90nm. | web.archive.org[2] |
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the 6540 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6540 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 6540 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6540 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No publicly documented compatible parts, consumables, or accessories for the 6540 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 6540 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.
The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.