Waferpedia

Tegal

6540

Etch100mmdown to 90nmTegal 6540 family
Research Quality: 40% complete
6540 — web.archive.org
Fig. 016540web.archive.org[1]

Wafer size

100mm

Node / era

down to 90nm

What is it?

The Tegal 6540 is described as a high-density plasma etch tool with dual-frequency RF power application and magnetic plasma confinement. Source material says it is used for etching materials including platinum, iridium, ferroelectric materials, high-k dielectrics, and gold interconnects, and that it is used in MEMS, DRAM, embedded memory, FeRAM, and wireless-device applications.

What can it run?

Process applications and technology nodes documented for this tool.

  • MEMS fabrication
  • removing hard-to-etch materials
  • high-K decoupling capacitors
  • cell phones
  • other wireless devices
  • noble metal electrodes and capacitor structures
  • ferroelectric materials
  • high-K dielectric materials
  • compound semiconductor materials
  • interconnect materials
  • DRAM devices
  • embedded memory devices
  • FeRAM device manufacturing

What do the numbers mean?

Power & electrical1

Plasma technology
dual-frequency RF power technology / dual-frequency RF power application[1]
Accurate?

Wafer handling1

Wafer size
100mm – 200mm[2]
Accurate?

Configuration & options7

Type
high-density plasma etch system[1]
Accurate?
Type
high-density plasma etch tool[2]
Accurate?
Reactor
HRe reactor / HRe™ reactor[1]
Accurate?
Reactor
HRe™ reactor[3]
Accurate?
Plasma confinement
magnetic plasma confinement[1]
Accurate?
Optimized design rule
down to 0.13 micron[1]
Accurate?
Optimized design rule
down to 90nm[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
6540 HReSame 6540 line name used for a version described as a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement; wafer size stated as 100mm–200mm and optimized down to 90nm.web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Plasma technologydual-frequency RF power technology / dual-frequency RF power application[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 6540 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6540 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 6540 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 6540 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the 6540 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 6540 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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