Waferpedia

Zygo

Z3D-7000

Metrology & Inspection200mm5th generationZygo Z3D-7000 family
Research Quality: 40% complete
Z3D-7000 — web.archive.org
Fig. 01Z3D-7000web.archive.org[1]

What is it?

ZYGO describes the Z3D-7000 as an advanced process metrology system for semiconductor wafers. It is a non-contacting, non-destructive optical metrology tool for production wafers, and it can be configured to handle 200 mm and 300 mm wafers or both sizes as a bridge tool.

What can it run?

Process applications and technology nodes documented for this tool.

  • Process control
  • Photolithography
  • Etch
  • Bumping processes
  • Transistor formation
  • Interconnect
  • Film thickness measurement
  • Critical dimensions measurement
  • Overlay measurement
  • Laser scribe measurement
  • Wafer curvature measurement
  • Film stress tracking

What do the numbers mean?

Wafer handling3

Wafer sizes
200 mm and 300 mm wafers[1]
Accurate?
Bridge-tool configuration
Can be configured to simultaneously handle both wafer sizes[1]
Accurate?
Loaded wafers
FOUPS and/or open cassettes[1]
Accurate?

Optics & imaging1

Measurement type
Non-contacting, non-destructive optical metrology[1]
Accurate?

Control & software2

Key features
High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[1]
Accurate?
Software
MetroPro software[1]
Accurate?

Configuration & options1

Technology
ZYGO's fifth generation interferometric technology[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the Z3D-7000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Z3D-7000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Z3D-7000 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Z3D-7000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Z3D-7000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Z3D-7000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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